A user's view of MCM-D/C packaging: is it worth the trouble?

Bartley, J.

doi:10.1109/ectc.1996.517386

Cited by 6 publications

(2 citation statements)

References 5 publications

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“…Processing limitations caused by the outgassing requirement in the polymer curing steps impose the use of nonideal ground planes with mesh designs. Such mesh reference planes result in increased propagation delay and cross talk [52], [53].…”

Section: Thin-film Wiringmentioning

confidence: 99%

Electrical characteristics of interconnections for high-performance systems

Deutsch

1998

Proc. IEEE

151

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A review is presented of the electrical characteristics of highdensity, high-performance interconnections used in digital and communication applications. These interconnections behave as lossy transmission lines for the frequency range of interest. A brief theoretical explanation of the key properties of lossy, coupled transmission lines is given. A new short-pulse propagation technique used for characterizing a large category of wiring is described. A detailed description is made of each of the major interconnect types encountered, namely, shielded cables, printed circuit boards, ceramic carriers, thin-film wiring, and on-chip wiring. Representative examples are given in each case to highlight the key performance-limiting parameters. The modeling and measurement techniques used are explained and examples are given. Future technological directions and their effect on performance are discussed.

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Section: Thin-film Wiringmentioning

confidence: 99%

Electrical characteristics of interconnections for high-performance systems

Deutsch

1998

Proc. IEEE

151

View full text Add to dashboard Cite

show abstract

“…By design, the 8 PPIs in the brick was chosen for two reasons: (1) wire off-module nets [3], and (2) provide overflow capability in the event wiring could not be contained in the thin films. As it turned out, the latter contingency did not have to be used.…”

Section: Physical Design Descriptionmentioning

confidence: 99%