A versatile polysilicon diaphragm pressure sensor chip

Chau, Kevin; Fung, C.D.; Harris, Paul; Dahrooge, G.

doi:10.1109/iedm.1991.235312

Cited by 11 publications

(6 citation statements)

References 1 publication

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“…They have advantages of high performance-to-price ratio, high reliability, stability and sensitivity, low power consumption, no turn-on temperature drift, and lower sensitivity to side stress and other environment effects. In microelectromechanical systems (MEMS), they usually use silicon or silicon carbide thin films [ 15 , 16 , 17 ], polymer/ceramic thin films [ 18 ] or low-temperature co-fired ceramics thin films [ 19 ], or graphene-polymer heterostructure thin films [ 20 , 21 , 22 , 23 ].…”

Section: Introductionmentioning

confidence: 99%

Polymer Conductive Membrane-Based Non-Touch Mode Circular Capacitive Pressure Sensors: An Analytical Solution-Based Method for Design and Numerical Calibration

Zhang

et al. 2022

Polymers

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In this paper, an analytical solution-based method for the design and numerical calibration of polymer conductive membrane-based non-touch mode circular capacitive pressure sensors is presented. The accurate analytical relationship between the capacitance and applied pressure of the sensors is derived by using the analytical solution for the elastic behavior of the circular polymer conductive membranes under pressure. Based on numerical calculations using the accurate analytical relationship and the analytical solution, the analytical relationship between the pressure as output and the capacitance as input, which is necessary to achieve the capacitive pressure sensor mechanism of detecting pressure by measuring capacitance, is accurately established by least-squares data fitting. An example of how to arrive at the design and numerical calibration of a non-touch mode circular capacitive pressure sensor is first given. Then, the influence of changing design parameters such as membrane thickness and Young’s modulus of elasticity on input–output relationships is investigated, thus clarifying the direction of approaching the desired input–output relationships by changing design parameters.

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Section: Introductionmentioning

confidence: 99%

Polymer Conductive Membrane-Based Non-Touch Mode Circular Capacitive Pressure Sensors: An Analytical Solution-Based Method for Design and Numerical Calibration

Zhang

et al. 2022

Polymers

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“…Capacitive pressure sensors are attractive for many applications such as control systems, industrial processing systems, automotive systems and biomedical systems because of their relatively high sensitivity, excellent hysteresis and repeatability characteristics, low temperature dependence, very good long-term stability, and low power consumption compared to piezoresistance pressure sensors [1][2]. The structure of a capacitive pressure sensor comprises a cavity Si Layer which forms the vacuum cavity, a Si diaphragm used with the upper electrode which also provides the capacitance change, and a glass substrate used to form the lower electrode and provide the air gap.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of capacitive absolute pressure sensor using Si-Au eutectic bonding in SOI wafer

Lee¹,

Kim²,

Park³

et al. 2006

J. Phys.: Conf. Ser.

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Abstract.A capacitive absolute pressure sensor was fabricated using a large deflected diaphragm with a sealed vacuum cavity formed by removing handling silicon wafer and oxide layers from a SOI wafer after eutectic bonding of a silicon wafer to the SOI wafer. The deflected displacements of the diaphragm formed by the vacuum cavity in the fabricated sensor were similar to simulation results. Initial capacitance values were about 2.18pF and 3.65pF under normal atmosphere, where the thicknesses of the diaphragm used to fabricate the vacuum cavity were 20 and 30 , respectively. Also, it was confirmed that the differences of capacitance value from 1000hPa to 5hPa were about 2.57pF and 5.35pF, respectively.

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“…Microelectromechanical systems have a wide variety of applications performing basic signal transduction operations as sensors and actuators. Suspended micromachined structures such as plates and beams are commonly used in the manufacturing of pressure [2][3][4][5] and acceleration sensors [6,7]. MEMS components have relatively large areas, but very small stiffness.…”

Section: Introductionmentioning

confidence: 99%

Suppression of Stiction in MEMS

Mastrangelo

1999

MRS Proc.

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Stiction failures in microelectromechanical systems (MEMS) occur when suspended elastic members are unexpectedly pinned to their substrates. This type of device failure develops both in fabrication and during device operation, being a dominant source of yield loss in MEMS. Stiction failures require first a collapse force that brings the elastic member contact with the substrate followed by an intersolid adhesion sufficiently large to overcome the elastic restoring force. Stiction failure mechanisms have been studied extensively elsewhere [1]. This paper briefly summarizes these mechanisms in a the practical way. Over the last decade, stiction failure rates in MEMS have been minimized using a wide variety of processing, surface treatment, and physical schemes. An update of these methods is provided.

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A versatile polysilicon diaphragm pressure sensor chip

Cited by 11 publications

References 1 publication

Polymer Conductive Membrane-Based Non-Touch Mode Circular Capacitive Pressure Sensors: An Analytical Solution-Based Method for Design and Numerical Calibration

Polymer Conductive Membrane-Based Non-Touch Mode Circular Capacitive Pressure Sensors: An Analytical Solution-Based Method for Design and Numerical Calibration

Fabrication of capacitive absolute pressure sensor using Si-Au eutectic bonding in SOI wafer

Suppression of Stiction in MEMS

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