A wafer mapping technique for residual stress in surface micromachined films

Schiavone, Giuseppe; Murray, Joanne F.; Smith, S.; Desmulliez, Marc Phillipe Yves; Mount, Andrew R.; Walton, A.J.

doi:10.1088/0960-1317/26/9/095013

Cited by 20 publications

(17 citation statements)

References 42 publications

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“…Asides semiconductors, other issues such as the influence of different process conditions on mechanical properties of electroplated materials and the control of the integrity of the electroplated layers as it relates to further processing have also been the raised [86,87], but not discussed in this communication.…”

Section: Post-growth Treatmentmentioning

confidence: 99%

“…techniques such as [77], MOCVD [84], and CSS [85] also require such treatments, as it is evident in the performances of the applications utilised for References [81][82][83]. Asides semiconductors, other issues such as the influence of different process conditions on mechanical properties of electroplated materials and the control of the integrity of the electroplated layers as it relates to further processing have also been the raised [86,87], but not discussed in this communication.…”

Section: All-electroplated Photovoltaic Devicesmentioning

confidence: 99%

See 1 more Smart Citation

Electroplating of Semiconductor Materials for Applications in Large Area Electronics: A Review

Ojo

Dharmadasa

2018

Coatings

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The attributes of electroplating as a low-cost, simple, scalable, and manufacturable semiconductor deposition technique for the fabrication of large-area and nanotechnology-based device applications are discussed. These strengths of electrodeposition are buttressed experimentally using techniques such as X-ray diffraction, ultraviolet-visible spectroscopy, scanning electron microscopy, atomic force microscopy, energy-dispersive X-ray spectroscopy, and photoelectrochemical cell studies. Based on the results of structural, morphological, compositional, optical, and electronic properties evaluated, it is evident that electroplating possesses the capabilities of producing high-quality semiconductors usable for producing excellent devices. In this paper we will describe the progress of electroplating techniques mainly for the deposition of semiconductor thin film materials and their treatment processes, and fabrication of solar cells.

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Section: Post-growth Treatmentmentioning

confidence: 99%

Section: All-electroplated Photovoltaic Devicesmentioning

confidence: 99%

Electroplating of Semiconductor Materials for Applications in Large Area Electronics: A Review

Ojo

Dharmadasa

2018

Coatings

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“…The integration of appropriately designed test devices in the layout of a MEMS reticle offers a highly sensitive approach to determine residual tensile or compressive stresses in different layers of a given system of different materials. The bending, displacement, or rotation of the test devices is measured optically or by SEM and correlated to analytical or numerical models to characterize the stress distribution in the layers of interest. The stated detectable stress variations are typically smaller when compared with 20 MPa, but for optimized devices even as small as 1.5 MPa …”

Section: Micro‐ and Nanomechanical Stress And Strain Measurementsmentioning

confidence: 99%

Advanced Characterization Methods for Electrical and Sensoric Components and Devices at the Micro and Nano Scales

Sheremet

Meszmer

Blaudeck

et al. 2019

Physica Status Solidi (a)

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The present study covers the nanoanalysis methods for four key material characteristics: electrical and electronic properties, optical, stress and strain, and chemical composition. With the downsizing of the geometrical dimensions of the electronic, optoelectronic, and electromechanical devices from the micro to the nanoscale and the simultaneous increase in the functionality density, the previous generation of microanalysis methods is no longer sufficient. Therefore, the metrology of materials' properties with nanoscale resolution is a prerequisite in materials' research and development. The article reviews the standard analysis methods and focuses on the advanced methods with a nanoscale spatial resolution based on atomic force microscopy (AFM): current-sensing AFM (CS-AFM), Kelvin probe force microscopy (KPFM), and hybrid optical techniques coupled with AFM including tip-enhanced Raman spectroscopy (TERS), photothermal-induced resonance (PTIR) characterization methods (nano-Vis, nano-IR), and photo-induced force microscopy (PIFM). The simultaneous acquisition of multiple parameters (topography, charge and conductivity, stress and strain, and chemical composition) at the nanoscale is a key for exploring new research on structure-property relationships of nanostructured materials, such as carbon nanotubes (CNTs) and nano/microelectromechanical systems (N/MEMS). Advanced nanocharacterization techniques foster the design and development of new functional materials for flexible hybrid and smart applications.

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“…The test structure architecture used in this work is shown in Fig. 1 [25,26] and consists of two expansion arms and a pointer arm of width (W=8 µm) underneath which a sacrificial layer has been removed. Depending on whether the arms are in compression or tensile the pointer arm rotates in a different direction.…”

Section: Test Chip Design and Fabricationmentioning

confidence: 99%

The Use of Test Structures to Perform Chip Level Characterization Studies of Ni and NiFe Electrochemical Deposition

Murray

Perry

Terry

et al. 2017

IEEE Trans. Semicond. Manufact.

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This paper describes the first use of test structures designed to characterise the fundamental properties of nickel and nickel-iron alloy films deposited using electroplating. The structures are used to perform a chip-level investigation into the effects of electrolyte bath composition on the characteristics of deposited films. The advantage of this methodology is that each electrolyte change does not require the replacement of the large volume bath associated with wafer scale manufacturing investigations, thereby making the characterisation and optimisation of electroplating baths far less time consuming, and considerably more cost effective.

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A wafer mapping technique for residual stress in surface micromachined films

Cited by 20 publications

References 42 publications

Electroplating of Semiconductor Materials for Applications in Large Area Electronics: A Review

Electroplating of Semiconductor Materials for Applications in Large Area Electronics: A Review

Advanced Characterization Methods for Electrical and Sensoric Components and Devices at the Micro and Nano Scales

The Use of Test Structures to Perform Chip Level Characterization Studies of Ni and NiFe Electrochemical Deposition

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