2023
DOI: 10.1039/d2tc05246f
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A water-borne photo-sensitive polyimide precursor for an eco-friendly process of preparing organic thin film transistors

Abstract: A water-borne photo-sensitive poly(amic acid) salt for the micropatterned polyimide layer of a microelectronic device.

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Cited by 7 publications
(6 citation statements)
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“…The coating solution used in this study was prepared by synthesizing an aqueous solution of W-PAAS, based on the 3,3, 4,4 -Biphenyl tetracarboxylic dianhydride (BPDA) and p-Phenylenediamine (pPDA) monomer, using a previously reported method. [34][35][36] The resulting W-PAAS was characterized using 1 H nuclear magnetic resonance ( 1 H NMR) and size exclusion chromatography (SEC), as shown in Figure S1 (Supporting Information). However, the use of aqueous solutions in large-area coating processes poses challenges due to the high surface tension of water.…”
Section: Large-area W-pi Thin-films Via Green Solvent-engineered Bar-...mentioning
confidence: 99%
See 1 more Smart Citation
“…The coating solution used in this study was prepared by synthesizing an aqueous solution of W-PAAS, based on the 3,3, 4,4 -Biphenyl tetracarboxylic dianhydride (BPDA) and p-Phenylenediamine (pPDA) monomer, using a previously reported method. [34][35][36] The resulting W-PAAS was characterized using 1 H nuclear magnetic resonance ( 1 H NMR) and size exclusion chromatography (SEC), as shown in Figure S1 (Supporting Information). However, the use of aqueous solutions in large-area coating processes poses challenges due to the high surface tension of water.…”
Section: Large-area W-pi Thin-films Via Green Solvent-engineered Bar-...mentioning
confidence: 99%
“…Recently, our research group reported that water-borne poly (amic acid) salts (W-PAAS), as a precursor of aromatic PI, were "one-step" directly polymerized using water as a solvent and low-temperature processing. [34][35][36] In particular, W-PAAS exhibited enhanced hydrolytic stability and homogeneous thin film formation without pinholes under ambient air by forming an ammonium salt with the carboxylate groups of PAA. As a result, it was possible to significantly improve the yield of the fabricated device by over 98%.…”
Section: Introductionmentioning
confidence: 99%
“…As an alternative approach, our group suggested the use of the poly­(amic acid) salt (PAAS) polymer as the macrosurfactant of an oil-in-water (o/w) HIPE. , The water-soluble PAAS polymer displays an intrinsic amphiphilicity due to its chemical structure consisting of the aromatic polymer backbone conjugated with protonated organic bases. The PAAS polymer poly­(3,3′,4,4′-biphenyltetracarboxylic dianhydride- co - m -tolidine) conjugated with N,N′ -dimethylethanolamine (BPDA-mTB/DMEA) exhibits a sufficient amphiphilicity to form a (o/w) HIPE having an internal volume of >80 vol %, even at a low PAAS mass content (∼3 wt %). Furthermore, porous PI was successfully obtained by converting the PAAS to PI scaffold via a well-known thermal imidization process. , The Macro PI obtained via our emulsion template method is thermally stable with elastic properties and is useful as a solar desalination membrane and separator in Li-metal batteries.…”
Section: Introductionmentioning
confidence: 99%
“…25 PI is a flexible transparent polymer with good high-temperature stability, excellent transparency, and excellent insulation, [26][27][28] which has been widely used in optoelectronic and microelectronic fabrications. [29][30][31][32][33] However, PI has a strong hygroscopicity. 34,35 The introduction of alicyclic structures, 36,37 bulky substituents, 38,39 asymmetric and rigid non-coplanar structures, [40][41][42] and inorganic nanoparticles 43,44 into polymer backbones could improve their transmittance, because such structures can effectively disrupt the regularity of molecular chains, giving the material body an amorphous or low crystallinity character.…”
Section: Introductionmentioning
confidence: 99%
“…However, they cannot be used in the high temperature situation 25 . PI is a flexible transparent polymer with good high‐temperature stability, excellent transparency, and excellent insulation, 26–28 which has been widely used in optoelectronic and microelectronic fabrications 29–33 . However, PI has a strong hygroscopicity 34,35 …”
Section: Introductionmentioning
confidence: 99%