Ablation of polyimide thin-film on carrier glass using 355 nm and 37 ns laser pulses

Kim, Yoonsuk; Noh, Youngsu; Park, Seung Ho; Kim, Byung-Kuk; Kim, Hyoung June

doi:10.1016/j.ijheatmasstransfer.2019.118896

Cited by 23 publications

(23 citation statements)

References 36 publications

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“…One possible mechanism is photochemical ablation, in which the chemical bonds of the material are broken by electron excitation. Another possible mechanism is photothermal ablation, which is governed by the bulk photothermal bond breakage and gasification of polymer materials [ 12 ]. It is known that the LTHC layer converts light energy to heat energy; thus, the driving force of the XF-LO process is considered to be the volumetric ablation and gasification of the polymer material by the photothermal mechanism.…”

Section: Resultsmentioning

confidence: 99%

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Investigation of the Chemical Structure of Ultra-Thin Polyimide Substrate for the Xenon Flash Lamp Lift-off Technology

et al. 2021

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Lift-off is one of the last steps in the production of next-generation flexible electronics. It is important that this step is completed quickly to prevent damage to ultrathin manufactured electronics. This study investigated the chemical structure of polyimide most suitable for the Xe Flash lamp–Lift-Off process, a next-generation lift-off technology that will replace the current dominant laser lift-off process. Based on the characteristics of the peeled-off polyimide films, the Xe Flash lamp based lift-off mechanism was identified as photothermal decomposition. This occurs by thermal conduction via light-to-heat conversion. The synthesized polyimide films treated with the Xe Flash lamp–Lift-Off process exhibited various thermal, optical, dielectric, and surface characteristics depending on their chemical structures. The polyimide molecules with high concentrations of –CF3 functional groups and kinked chemical structures demonstrated the most promising peeling properties, optical transparencies, and dielectric constants. In particular, an ultra-thin polyimide substrate (6 μm) was successfully fabricated and showed potential for use in next-generation flexible electronics.

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Section: Resultsmentioning

confidence: 99%

“…Finally, the whole device, including the flexible PI substrate, is detached from the carrier substrate. The final step, the laser lift-off (LLO) process, is one of the key techniques of flexible electronics manufacturing and determines the production speed and yield of the process [ 10 , 11 , 12 ].…”

Section: Introductionmentioning

confidence: 99%

Investigation of the Chemical Structure of Ultra-Thin Polyimide Substrate for the Xenon Flash Lamp Lift-off Technology

et al. 2021

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“…The LIIS process requires laser irradiations from the backside of the glass, which makes the ablation initiate inside the PI film rather than on its surface. Therefore, a bulk photothermal model was adopted to simulate the ablation process involved in LIIS . The calculations of temperature distributions in PI are essential for the presented model, which dominate the decomposition reaction (thermally breaking chemical bonds).…”

Section: Experiments and Modeling Of Liismentioning

confidence: 99%

“…A 1D heat diffusion equation is first given as (the coordinate is fixed at the PI–glass interface) where T is the temperature, ρ is the density, C p ( T ) is the specific heat, κ( T ) is the thermal conductivity, and Q is the source term. The source term Q involves the absorption of laser light (the left term) as well as a term that represents the heat loss of chemical reactions (the right term) where Δ H e is the enthalpy required to break a bond, and N 0 is the number of bonds per unit volume. The distribution of laser intensity I ( z , t ) in PI can be described by the Beer–Lambert law where α denotes the absorption coefficient of PI, which could be treated as a constant for nanosecond pulses .…”

Section: Experiments and Modeling Of Liismentioning

confidence: 99%

“…Additionally, it is recognized that LLO can provide a reliable way for the fabrication of large-area flexible electronics using polyimide (PI) films as flexible substrates, as well as sacrificial layers. − However, the intrinsic process mechanism of this widely used LLO process is still unclear. Since an ablation crater had been observed under the irradiation of UV pulse laser, laser ablation of the interfacial polymer was widely considered to be responsible for the LLO process. − Most recently, this ablation process involved in LLO was simulated properly . All previous studies suggested that the delamination mechanism could result from the “evaporation” of a thin layer of PI at the interface due to the laser ablation.…”

Section: Introductionmentioning

confidence: 99%

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Laser-Induced Interfacial Spallation for Controllable and Versatile Delamination of Flexible Electronics

Bian

Chen

Yang

et al. 2020

ACS Appl. Mater. Interfaces

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The control of interface status is greatly critical to release large-area, ultrathin flexible electronics from the donor wafer to achieve mechanical flexibility. This paper discovers a laser-induced interfacial spallation process for controllable and versatile delamination of polyimide (PI) films from transparent substrates and makes a comprehensive mechanism study of the controllability of interfacial delamination after laser irradiations. Microscopic observations show that backside irradiations will result in the formation of nanocavities around the PI−glass interface, enabling a significant decrease in interface adhesion. Theoretical calculations indicate that gas products generated from thermal decomposition of PI will cause hydrodynamic spallation of molten PI around the interface. The controllable spallation behavior benefits the formation/elimination of fibrous microconnections between the PI film and glass substrate. A substantial regulation of interfacial micromorphologies can achieve precise control of interface adhesion, mass production of functional nanostructures, and nondestructive peeling of ultrathin flexible devices. The results could be useful for the fabrication of flexible electronics and biomimetic surfaces.

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Flexible Oxide Thin Film Transistors, Memristors, and Their Integration

Panca

Panidi

Faber

et al. 2023

Adv Funct Materials

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Flexible electronics have seen extensive research over the past years due to their potential stretchability and adaptability to non‐flat surfaces. They are key to realizing low‐power sensors and circuits for wearable electronics and Internet of Things (IoT) applications. Semiconducting metal‐oxides are a prime candidate for implementing flexible electronics as their conformal deposition methods lend themselves to the idiosyncrasies of non‐rigid substrates. They are also a major component for the development of resistive memories (memristors) and as such their monolithic integration with thin film electronics has the potential to lead to novel all‐metal‐oxide devices combining memory and computing on a single node. This review focuses on exploring the recent advances across all these fronts starting from types of suitable substrates and their mechanical properties, different types of fabrication methods for thin film transistors and memristors applicable to flexible substrates (vacuum‐ or solution‐based), applications and comparison with rigid substrates while additionally delving into matters associated with their monolithic integration.

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Ablation of polyimide thin-film on carrier glass using 355 nm and 37 ns laser pulses

Cited by 23 publications

References 36 publications

Investigation of the Chemical Structure of Ultra-Thin Polyimide Substrate for the Xenon Flash Lamp Lift-off Technology

Investigation of the Chemical Structure of Ultra-Thin Polyimide Substrate for the Xenon Flash Lamp Lift-off Technology

Laser-Induced Interfacial Spallation for Controllable and Versatile Delamination of Flexible Electronics

Flexible Oxide Thin Film Transistors, Memristors, and Their Integration

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Ablation of polyimide thin-film on carrier glass using 355 nm and 37 ns laser pulses

Cited by 23 publications

References 36 publications

Investigation of the Chemical Structure of Ultra-Thin Polyimide Substrate for the Xenon Flash Lamp Lift-off Technology

Investigation of the Chemical Structure of Ultra-Thin Polyimide Substrate for the Xenon Flash Lamp Lift-off Technology

Laser-Induced Interfacial Spallation for Controllable and Versatile Delamination of Flexible Electronics

Flexible Oxide Thin Film Transistors, Memristors, and Their Integration

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Product

Resources

About

Ablation of polyimide thin-film on carrier glass using 355 nm and 37 ns laser pulses