2002
DOI: 10.1016/s0169-4332(02)00463-4
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Ablation threshold dependence on pulse duration for copper

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Cited by 201 publications
(109 citation statements)
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“…1,2 Femtosecond (fs) laser processing can be applied to micro-and nanometer fabrication of various materials such as metals, 3,4 semiconductors, 5 and insulators. 6 Surface modification such as the formation of periodic grating structures on a metal surface has also been demonstrated under irradiation with multiple fs laser pulses, [7][8][9][10] and these structures have been actively studied. 11,12 The observed grating spacing was of the scale of several hundreds of nanometers, and was sometimes shorter than the irradiation laser wavelength.…”
Section: Introductionmentioning
confidence: 99%
“…1,2 Femtosecond (fs) laser processing can be applied to micro-and nanometer fabrication of various materials such as metals, 3,4 semiconductors, 5 and insulators. 6 Surface modification such as the formation of periodic grating structures on a metal surface has also been demonstrated under irradiation with multiple fs laser pulses, [7][8][9][10] and these structures have been actively studied. 11,12 The observed grating spacing was of the scale of several hundreds of nanometers, and was sometimes shorter than the irradiation laser wavelength.…”
Section: Introductionmentioning
confidence: 99%
“…However, it has not been possible to obtain sufficient emission uniformity at low applied electric fields using these methods. Recently, a periodic nano-structure formation produced by femtosecond laser ablation [5] [6] has been demonstrated for various materials such as metals [7], dielectrics [8] [9], and semiconductors [10]. The periodic formation originates from the interference between the incident laser and the scattered wave (or plasma wave) along the surface.…”
Section: Introductionmentioning
confidence: 99%
“…Ultrashort laser ablation is a very complicated process, and further work is still needed to completely understand the fundamental ablation mechanisms. Earlier investigations show that material removal during ultrashort laser ablation may be realized through one or a combination of the following mechanisms, such as spallation, Coulomb explosion, phase explosion, critical-point phase separation (CPPS), and fragmentation [23,[33][34][35][36][37][38][39][40][41][42][43][44][45][46]. The actual mechanisms depend on laser intensity, wavelength, material types, etc.…”
Section: Ultrashort-pulsed Laser Ablationmentioning
confidence: 99%