2019 IEEE International Symposium on Electromagnetic Compatibility, Signal &Amp; Power Integrity (EMC+SIPI) 2019
DOI: 10.1109/isemc.2019.8825282
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Accurate Socket Modeling And Validation For SI/PI Applications Considering Contact Resistance

Tao Wang
1
,
Varin Sriboonlue
2
,
Selman Ozbayat
3
et al.
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A Study of Signal Integrity on Hybrid Land Grid Array Socket Connector

Bi,
Liu,
Yi
2023
2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility and International Conference on ElectroMagneti
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A Study of Signal Integrity on Hybrid Land Grid Array Socket Connector

Bi,
Liu,
Yi
2023
2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility and International Conference on ElectroMagneti
1
0
0
0
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Comprehensive Socket Characterization and Correlation for High-speed Interface Testing System

Sriboonlue,
Jeon,
Luevano
et al. 2024
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Measurement-and-Simulation-Based Determination of Electrical Properties of Au-Ni Composite Pins in Elastomeric Sockets

Ozbayat
1
,
Sriboonlue
2
,
Wang
3
et al. 2019
IEEE Lett. on Electromagn. Compat. Pract. and Appl.
2
0
1
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