Achieving excellent thermal transport in diamond/Cu composites by breaking bonding strength-heat transfer trade-off dilemma at the interface

Chang, Guo; Zhang, Shuang; Chen, Kaiyun; Zhang, Wei; Li, Liang; Zhang, Yongjian; Peng, Haoran; Kan, Dongxiao; Wang, Luhua; Zhang, Hailong; Huo, Wangtu

doi:10.1016/j.compositesb.2024.111925

Composites Part B: Engineering

2025

DOI: 10.1016/j.compositesb.2024.111925

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Achieving excellent thermal transport in diamond/Cu composites by breaking bonding strength-heat transfer trade-off dilemma at the interface

Guo Chang,

Shuang Zhang,

Kaiyun Chen

et al.

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Decoupling enhancements of breakdown strength and dielectric constant in PMIA-based composite films for high-temperature capacitive energy storage

Zhang,

Xu,

Fan

et al. 2025

Composites Part B: Engineering

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Decoupling enhancements of breakdown strength and dielectric constant in PMIA-based composite films for high-temperature capacitive energy storage

Zhang,

Xu,

Fan

et al. 2025

Composites Part B: Engineering

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Achieving excellent thermal transport in diamond/Cu composites by breaking bonding strength-heat transfer trade-off dilemma at the interface

Cited by 1 publication

References 55 publications

Decoupling enhancements of breakdown strength and dielectric constant in PMIA-based composite films for high-temperature capacitive energy storage

Decoupling enhancements of breakdown strength and dielectric constant in PMIA-based composite films for high-temperature capacitive energy storage

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