Achieving highly anisotropic thermal and electrical conductivities via synergistic distribution of boron nitride and graphene nanosheets in multilayered composites

Cerium Methacrylate Assisted Preparation of Highly Thermally Conductive and Anticorrosive Multifunctional Coatings for Heat Conduction Metals Protection

“…Notably, among these coatings, F-CB/CEP coating with 50 wt% BN exhibits optimal corrosion resistance, including consistently highest |Z| 0.01 Hz and phase angle values at low frequency region, as well as the maximum capacitive arc throughout the immersion time. Meanwhile, even after 181 days of immersion, there is still no breakpoint frequency (f b ) in the Bode plots of the F-CB/CEP coating, and |Z| 0.01 Hz is maintained at 5.1 × 10 11 Ω cm 2 . This indicates that the coating has not delaminated and has good adhesion to the substrate.…”

“…Along with technology development of high power, miniaturization and energy saving, the accompanying heat transfer and heat accumulation problems have led to urgent demands for advanced and effective thermal management materials [1][2][3]. Most metals possess satisfactory thermal conductivity (TC), making them favorable candidates for heat dissipation materials [4,5].…”

Design of 3D graphene‐Ni microsphere based polymeric composites for highly efficient and absorption‐dominated electromagnetic interference shielding performance

“…The most commonly adopted route to fabricate related polymeric composites is directly blending fillers with polymer matrix. Unfortunately, the actual results remain unsatisfying either because of the demand for large amount of conductive fillers to construct conductive network, or due to the consequent poor processability and mechanical property originating from the overfilling of fillers 36–38 . To fix such problem, the key challenge lies in distribution regulation of the fillers to establish a well‐defined conductive network under the lowest possible filler content.…”

“…Unfortunately, the actual results remain unsatisfying either because of the demand for large amount of conductive fillers to construct conductive network, or due to the consequent poor processability and mechanical property originating from the overfilling of fillers. [36][37][38] To fix such problem, the key challenge lies in distribution regulation of the fillers to establish a well-defined conductive network under the lowest possible filler content. Inspired by such motif, considerable efforts have been dedicated to the development of EMI shielding materials with novel hierarchical structures like sandwich structure, 39,40 segregated structure [41][42][43] and foam structure 44,45 et al Tan's 46 work revealed that through alternating multilayered assembly of CS and MXene, the obtained film, with a thickness of 35 μm, showcases not only an impressive EMI SE of 40.8 dB but also a remarkably high specific EMI SE (SSEt) reaching 10, 650 dB cm 2 g À1 .…”