2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 2024
DOI: 10.1109/ectc51529.2024.00215
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Achieving Sub-nm Copper Recess Controllability for Advanced 3D Integration: An Experimental and Atomic-scale Simulation Study on Wet Atomic Layer Etching Process

Seung Ho Hahn,
Wooyoung Kim,
Kyeongbin Lim
et al.
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