Thermal contact resistance inhibits heat removal from electronic components, and can result in overheating, performance degradation, and failure. However, determining and/or verifying contact resistance can be challenging since it is dependent upon surface roughness and waviness; mechanical and thermal properties of mating solids; applied pressures; and properties of interstitial materials. Recent investigations have shown the potential of ultrasonic characterization as a correlating metric for evaluating interface contact resistance. The advantage is the responsive, on-demand nature of this approach compared to traditional, time-intensive thermal testing. The work presented here explores the utility of ultrasonic characterization as a correlating metric for evaluating thermal contact resistance in a vacuum environment. Results show that ultrasonic measurements have significant potential contribution for evaluating thermal interfaces for space systems since they are limited to 'conductive' energy transfer regardless of the presence of atmosphere. Developing a correlation algorithm to relate ultrasonic transmissions to thermal transmission will allow technicians to evaluate systems in real-time and on-demand. This level of responsiveness can result in significant improvements to cost, schedule, performance, and risk. Nomenclature h = convective heat transfer coefficient, W/m 2 -K k = thermal conductivity, W/m-K , cond x q = conductive heat flux, W/m 2 conv q = convective heat flux, W/m 2 rad q = radiative heat flux, W/m 2 T = temperature, K Greek Symbols = emissivity, dimensionless = Stefen-Boltzmann constant, 5.67x10 -8 W/m 2 -K 4 Superscripts/Subscripts s = surface, dimensionless