Activation of melts by the energy of ultrasonic and infrared fields

Lanin, V. L.

doi:10.3103/s106837551005011x

Cited by 3 publications

(2 citation statements)

References 1 publication

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“…The self-propagating nature of some reactive multilayers has potential for joining applications and has been a topic of intense research during the last decades [e.g. 6,7]. Reactive multilayers are composed of tens, hundreds, or thousands of alternating individual layers of reactants having large negative enthalpy of mixing.…”

Section: Introductionmentioning

confidence: 99%

Characterization of ultrasonic soldering of Ti and Ni with Ni/Al reactive multilayer deposition

et al. 2019

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The joining of Ti and Ni at low temperatures was analysed in this work. For joining pure Ti and Ni coins of 1.5 mm in thickness were used. Reactive multilayer thin films/foils with nanometric period (bilayer thickness), in particular Ni/Al multilayers, have been used to promote joining in two thickness of 28 and 55 nm. The ultrasonic soldering with SnAgTi active solder has been used for “hard-to-solder” material. The structural evaluation of soldered joint was studied by optical microscopy and EDX analysis. The structural analysis was focused to the creation of intermetallic layers in the joint interface. The mechanical properties of solder joints were tested by shear strength.

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Section: Introductionmentioning

confidence: 99%

Characterization of ultrasonic soldering of Ti and Ni with Ni/Al reactive multilayer deposition

et al. 2019

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“…The corrosion resistance of soldered joints fabricated with ultrasound (UT) results mainly from the fact that no flux is necessary in this soldering technology. Lanin [12] described a method of UT soldering with the new solders with the aim to obtain longer joint life. The publication Koleňák et al [13,14] performed the comparison of shear strength of joints fabricated by use of UT and those soldered in vacuum.…”

Section: Introductionmentioning

confidence: 99%

Shear Strength and Dsc Analysis of High-Temperature Solders

Koleňák¹,

Martinkovič²,

Koleňáková³

2013

Archives of Metallurgy and Materials

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The work is devoted to the study of shear strength of soldered joints fabricated by use of high-temperature solders of types Bi-11Ag, Au-20Sn, Sn-5Sb, Zn-4Al, Pb-5Sn, and Pb-10Sn. The shear strength was determined on metallic substrates made of Cu, Ni, and Ag. The strength of joints fabricated by use of flux and that of joints fabricated by use of ultrasonic activation without flux was compared. The obtained results have shown that in case of soldering by use of ultrasound (UT), higher shear strength of soldered joints was achieved with most solders. The highest shear strength by use of UT was achieved with an Au-20Sn joint fabricated on copper, namely up to 195 MPa. The lowest average values were achieved with Pb-based solders (Pb-5Sn and Pb-10Sn). The shear strength values of these solders used on Cu substrate varied from 24 to 27 MPa. DSC analysis was performed to determine the melting interval of lead-free solders.Keywords: high-temperature solders, lead-free solders, shear strength, ultrasonic soldering, DSC analysis Praca poświęcona jest badaniu wytrzymałości na ścinanie połączeń lutowanych wytwarzanych przy użyciu wysokotemperaturowych stopów lutowniczych typu Bi-11Ag, Au-20Sn, Sn-5Sb, Zn-4Al, Pb-5Sn i Pb-10Sn, na podłożach wykonanych z Cu, Ni i Ag. Porównano wytrzymałość spoin wytwarzanych przy użyciu topnika i spoin wytwarzanych przy użyciu aktywacji ultradźwiękowej bez topnika. Uzyskane wyniki wykazały, że w przypadku lutowania z wykorzystaniem ultradźwięków (UT), wyższa wytrzymałość na ścinanie połączeń lutowanych została osiągnięta dla większości stopów lutowniczych. Najwyższą wytrzymałość na ścinanie przy użyciu UT (tj. 195 MPa) uzyskano dla Au-20Sn na Cu. Najniższe średnie wartości zostały osiągnięte dla lutów na bazie Pb (Pb-5Sn i Pb-10Sn). Wartości wytrzymałości na ścinanie tych lutów na podłożach Cu waha się od 24 do 27 MPa. Analizę DSC przeprowadzono w celu określenia przedziału temperatur topnienia bezołowiowych stopów lutowniczych.

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Study of direct soldering of Al2O3 ceramics and Cu substrate by use of Bi11Ag2La solder

Koleňák

Hodúlová

2017

Weld World

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Activation of melts by the energy of ultrasonic and infrared fields

Cited by 3 publications

References 1 publication

Characterization of ultrasonic soldering of Ti and Ni with Ni/Al reactive multilayer deposition

Characterization of ultrasonic soldering of Ti and Ni with Ni/Al reactive multilayer deposition

Shear Strength and Dsc Analysis of High-Temperature Solders

Study of direct soldering of Al2O3 ceramics and Cu substrate by use of Bi11Ag2La solder

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