Active Peltier Effect Heat Sink for Power Semiconductor Device Thermal Stability Enhancement

Ding, Lijian; Song, Ruya; Zhao, Shuang; Wang, Jianing; Mantooth, Alan

doi:10.1109/tpel.2023.3290196

Cited by 8 publications

(1 citation statement)

References 39 publications

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“…Resistance tends to produce a thermal drift, which is a function of time t and temperature T [28][29][30]. Because there were thermal cycles in this SSADT, it was necessary to incorporate a Coffin-Manson component.…”

Section: Modelling Descriptionmentioning

confidence: 99%

A Reliability Analysis of a MEMS Flow Sensor with an Accelerated Degradation Test

Kang,

Lin,

Tao

2023

Sensors

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With the wide application of flow sensors, their reliability under extreme conditions has become a concern in recent years. The reliability of a Micro Electro Mechanical Systems (MEMS) flow sensor under temperature (Ts) is researched in this paper. This flow sensor consists of two parts, a sensor chip and a signal-processing system (SPS). Firstly, the step-stress accelerated degradation test (SSADT) is implemented. The sensor chip and the flow sensor system are tested. The results show that the biggest drift is 3.15% for sensor chips under 150 °C testing conditions, while 32.91% is recorded for the flowmeters. So, the attenuation of the SPS is significant to the degeneration of this flowmeter. The minimum drift of the SPS accounts for 82.01% of this flowmeter. Secondly, using the Coffin–Manson model, the relationship between the cycle index and Ts is established. The lifetime with a different Ts is estimated using the Arrhenius model. In addition, Weibull distribution (WD) is applied to evaluate the lifetime distribution. Finally, the reliability function of the WD is demonstrated, and the survival rate within one year is 87.69% under 85 °C conditions. With the application of accelerated degradation testing (ADT), the acquired results are innovative and original. This research illustrates the reliability research, which provides a relational database for the application of this flow sensor.

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Section: Modelling Descriptionmentioning

confidence: 99%

A Reliability Analysis of a MEMS Flow Sensor with an Accelerated Degradation Test

Kang,

Lin,

Tao

2023

Sensors

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Role of thermal stress-driven dislocation and low-angle grain boundary migration in surface plastic deformation and grain orientation evolution of tungsten under thermal shock

Ren,

Nie,

Wang

et al. 2025

International Journal of Plasticity

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Direct Metallization-Based DBC-Free Power Modules for Near-Junction Water Cooling: Analysis and Experimental Comparison

Wang,

Gong,

Long

et al. 2024

IEEE Trans. Power Electron.

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Reducing the thermal resistance is vital for power modules. Thermal conducting paths are formed by heterogeneous layers for insulation, causing inevitably high thermal resistance. In this paper, with the aid of direct metallization technology, a direct bonded copper (DBC) free power module concept is proposed to achieve near-junction water cooling. A 55% reduction of thermal resistance is achieved by using DBC-free power module instead of DBC interface. Reliability analysis indicates that the DBC-free power module is sufficiently reliable in terms of mechanical stress, fatigue, and peel strength. The junction temperature of the DBC-free power module is experimentally compared to indirectly and directly water cooled power module with the DBC interface. The proposed nearjunction water cooling method has effectively achieved reductions of 28°C and 11°C in junction temperature, respectively, under full load conditions when compared to the designs of indirectly and directly water-cooled power module. The maximum junction temperature rise ΔTj of indirectly water cooled power module is reduced from 50℃ to 21℃. The unlimited promise of direct metallization technology in 3D packaging is also highlighted.

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Active Peltier Effect Heat Sink for Power Semiconductor Device Thermal Stability Enhancement

Cited by 8 publications

References 39 publications

A Reliability Analysis of a MEMS Flow Sensor with an Accelerated Degradation Test

A Reliability Analysis of a MEMS Flow Sensor with an Accelerated Degradation Test

Role of thermal stress-driven dislocation and low-angle grain boundary migration in surface plastic deformation and grain orientation evolution of tungsten under thermal shock

Direct Metallization-Based DBC-Free Power Modules for Near-Junction Water Cooling: Analysis and Experimental Comparison

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