Active thermal control of power electronic modules

Abstract

Abstract-Active thermal control techniques make it feasible to regulate the steady state and transient thermal-mechanical stress in power electronic modules for applications such as motor drives. Online junction temperature estimation and manipulation of the switching frequency and current limit to regulate the losses are used to prevent overtemperature and power cycling failures in insulated gate bipolar transistor (IGBT) power modules. The techniques developed in this work are used to actively control the junction temperature of the power module. This control strategy improves power module reliability and increases utilization of the silicon thermal capacity by providing sustained operation at maximum attainable performance limits.

Review of Power Semiconductor Device Reliability for Power Converters

“…In [102], a new approach for junction temperature estimation is investigated using an enhanced-Luenberger-style closed-loop observer. This technology can then be used as a sensor replacement technique for estimating junction tem- …”

“…On the basis of existing research, it is still necessary to find out more indicators that can reflect the health condition more comprehensively and understand the precursors' variation [92]- [94] [97]- [102] [106]…”

Temperature control of power semiconductor devices in traction applications

“…So, it is necessary to introduce some indirect techniques to measure or estimate the junction temperature. The technique allowing us to get come solution of this problem bases on the thermal equivalent circuit of the power semiconductor module [4,5]. The thermal equivalent circuit is presented by the multiple circuit of resistances and capacitors connected in series and parallel, the transient characteristics of it are given in the module datasheets as a thermal response in the single step reference or disturbance.…”

“…To simulate the automatic temperature control system, the Matlab Simulink is used in this investigation. The executive regulation device is described by equations (6) - (11), the thermal behavior of the semiconductor devices is evaluated by equations (1) - (5). The cooling fan is simulated by the proportional gain.…”

“…An automatic temperature control system of semiconductor devices Despite the fact that there are a number of techniques [4][5][6][7] allowing one to reduce junction temperature and its fluctuation by means of changing the frequency switching, this approach does not get wide implementation in the traction drives due to the complex dependences of mechanical processes including adhesion, skid and slipping effects in starting and braking modes and the frequency of the torque and current oscillation. The forced air or liquid convection by means of a fan, a blower or a pump is much prefferable in these applications.…”