2015
DOI: 10.1016/j.electacta.2015.04.161
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Activity of Small Silver Nanocubes as Activators for Electroless Copper Deposition

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Cited by 5 publications
(2 citation statements)
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References 41 publications
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“…The plating speeds were calculated by dividing the deposit thickness by the deposition time, after assuming a constant deposition rate. Many factors complicate this analysis: Before plating proceeds continuously, induction periods of variable timespans must pass through which the deposition potential is reached on the catalyst . In the case of nanoparticle‐seeded inactive substrates (like in our case), the catalytically active surface increases greatly during the initial stages of deposition.…”
Section: Resultsmentioning
confidence: 99%
“…The plating speeds were calculated by dividing the deposit thickness by the deposition time, after assuming a constant deposition rate. Many factors complicate this analysis: Before plating proceeds continuously, induction periods of variable timespans must pass through which the deposition potential is reached on the catalyst . In the case of nanoparticle‐seeded inactive substrates (like in our case), the catalytically active surface increases greatly during the initial stages of deposition.…”
Section: Resultsmentioning
confidence: 99%
“…This means that the deposition metal can only starts after the induction period. The induction period measurement was proved by the results from Electrochemical Quartz Crystal Microbalance (EQCM) [93,94]. The results from EQCM revealed that the time required before deposition of metal begins were the same as the induction period acquired in OCP measurements.…”
Section: Open-circuit Potential In Nickel Bathmentioning
confidence: 90%