4,4'-bismaleimidophcuyl methane (BM) and 3,3'-bismaleimidophenyl sulfone (BS)were blended in solution using weight ratios 3 : 1 (MS31), 2 : 1 (MS21), 1 : 1 (MSI 1), 1 : 2 (MSI2) and 1 : 3 (MS 13). Chain extended bismaleimide resins were also p~ax~d by treating BS/BM with 4,4'-diaminodiphenylether in molar ratios of 1:0.3 (BM-E and BS--E resins). These resins were also blended with bismaleimides and the curing characteristics were evaluated'by differential scanning calorimetry. Increase in BM content in BM : BS blends or increase in chain extended bismaleimide content in BM-E: BS or BS-E : BM blends resulted in a reduction of melting and curing temperatures. Indication about the extent of cross-linking was obtained from solubility measurements (in DMF) of isothermally cured resins (180 ~ lh and 220 ~ lh in an air oven). Thermo~avimetric analysis of samples isothermally cured at 180 ~ and 220 ~ (lh each) was carried out in nitrogen atmosphere. Improvement in thermal stability of chain extended bismaleimides was observed on blending.Bismaleimides are prime candidates as matrix resins for fibre reinforced composites and are finding increasing acceptance as engineering materials for high performance engineering applications. These resins are cured by thermally induced addition reaction giving highly crosslinked, void free network polymers having good physical properfies, thermal stability, better fire resistance and lower water absorption than currently used epoxy resins. Chain extended bismaleimides, obtained by nucleophilic addition reaction with aromatic diamine have also been used as resing for advanced fibre reinforced composites.In our earlier articles we have reported the synthesis and characterisation of bismaleimides and chain extentled bismaleimides [1-7]. Effect of structure on thermal characteristics of bismaleimides was also studied. It was observed that the presence of electron donor groups in bismaleimides reduces the melting and curing temperatures of the resins. On the other hand, presence of electron withdrawing groups results in higher melting point and curing temperature [8-9].Blending of bismaleimides containing electron withdrawing and electron donating substituents is expected to effect the melting and curing temperatures.
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