Additive Manufacturing of Hybrid Circuits

Sarobol, Pylin; Cook, Adam; Keicher, David M; Hirschfeld, Deidre A.; Hall, Aaron Christopher.; Bell, Nelson S.

doi:10.1146/annurev-matsci-070115-031632

Cited by 51 publications

(37 citation statements)

References 96 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…On the left and on the right side no tape was used. It leads to a gradual transition from coating to substrate, which is sometimes referred to as overspray [31,32].…”

Section: Resultsmentioning

confidence: 99%

Manufacturing Dense Thick Films of Lunar Regolith Simulant EAC-1 at Room Temperature

et al. 2019

View full text Add to dashboard Cite

The Aerosol Deposition (AD, also known as gas kinetic spraying or vacuum deposition) method is a rather novel coating process to produce dense thick films directly from dry ceramic (or metal) powders on a variety of substrates without any heat treatment. Because of the similarity of the up to now used powders and lunar regolith, it is imaginable to use AD systems for future in situ resource utilization missions on the Moon planned by several space agencies. To test the feasibility of such an endeavor, the processability of lunar mare simulant EAC-1 by the AD method has been examined in this study. Three regolith films with an area of 25 × 10 mm2, and thicknesses between 2.50 µm and 5.36 µm have been deposited on steel substrates using a standard AD setup. Deposited films have been investigated by Laser Scanning Microscopy (LSM) and Scanning Electron Microscopy (SEM). Moreover, the roughness and Vickers hardness of the deposited films and the underlying substrates have been measured. It has been shown that dense consolidated films of regolith simulant can be produced within minutes by AD. The deposited films show a higher roughness and, on average, a higher hardness than the steel substrates. Since on the Moon, naturally available regolith powders are abundant and very dry, and since the required process vacuum is available, AD appears to be a very promising method for producing dense coatings in future Moon exploration and utilization missions.

show abstract

“…On the left and on the right side no tape was used. It leads to a gradual transition from coating to substrate, which is sometimes referred to as overspray [31,32].…”

Section: Resultsmentioning

confidence: 99%

Manufacturing Dense Thick Films of Lunar Regolith Simulant EAC-1 at Room Temperature

et al. 2019

View full text Add to dashboard Cite

show abstract

“…The jet in aerosol jet printing is composed of numerous droplets with diameter of 2–5 µm instead of a single droplet in inkjet printing . Aerosol jet printing is considered as a potential competitor to inkjet printing and EHD printing in the fabrication of functional and structural materials as it also allows the maskless and noncontact deposition . In addition, due to the high nozzle‐to‐substrate distance, aerosol jet printing is compatible with nonplanar substrates; complicated patterns and structures can be printed on textured, stepped, or curved surfaces with almost constant linewidths …”

Section: Printing Technology: Materials and Recent Developmentmentioning

confidence: 99%

Printing Conductive Nanomaterials for Flexible and Stretchable Electronics: A Review of Materials, Processes, and Applications

Huang

Zhu

2019

Adv Materials Technologies

358

347

View full text Add to dashboard Cite

PE has been explored for the manufacturing of flexible and stretchable electronic devices by printing functional inks containing soluble or dispersed materials, [14][15][16] which has enabled a wide variety of applications, such as transparent conductive films (TCFs), flexible energy harvesting and storage, thin film transistors (TFTs), electroluminescent devices, and wearable sensors. [17][18][19][20][21][22][23][24] The global PE market should reach $26.6 billion by 2022 from $14.0 billion in 2017 at a compound annual growth rate of 13.6%. [25] PE devices are manufactured by a variety of printing technologies. Typical printing technologies can be divided into two broad categories: noncontact patterning (or nozzle-based patterning) and contact-based patterning. The noncontact techniques include inkjet printing, electrohydrodynamic (EHD) printing, aerosol jet printing, and slot die coating, while screen printing, gravure printing, and flexographic printing are examples of the contact techniques. Each of these techniques has its own advantages and disadvantages, but they all rely on the principle of transferring inks to a substrate. Understanding the characteristics and recent advances of each printing technique is important to further the progress in PE. Moreover, to promote the lab-scale printing technologies to large-scale production process, roll-toroll (R2R) printing, which is one of the manufacturing methods to obtain large-area films with low cost and excellent durability, has drawn much attention from both industry and the research community.Nearly all of devices based on PE require conductive structures, interconnects, and contacts; therefore, highly conductive patterns, usually with high transparency and/or high resolution, fabricated by means of printing conductive materials are one of the most critical components in PE devices. Various printable conductive nanomaterials, such as metal nanomaterials (e.g., metal nanoparticles and metal nanowires) and carbon nanomaterials (e.g., graphene and carbon nanotubes (CNTs)), have been explored and used as major materials for PE. Applying printing technology to deposition of the conductive nanomaterials requires formulation of suitable inks. After depositing inks on different substrates, post-printing treatment, Printed electronics is attracting a great deal of attention in both research and commercialization as it enables fabrication of large-scale, low-cost electronic devices on a variety of substrates. Printed electronics plays a critical role infacilitating widespread flexible electronics and more recently stretchable electronics. Conductive nanomaterials, such as metal nanoparticles and nanowires, carbon nanotubes, and graphene, are promising building blocks for printed electronics. Nanomaterial-based printing technologies, formulation of printable inks, post-printing treatment, and integration of functional devices have progressed substantially in the recent years. This review summarizes basic principles and recent development of common printing technologie...

show abstract

“…In order to gain the full benefit of the fusion of AM and established techniques in the future, a transition from such sequential fabrication to a complete integration of metal AM into existing process workflows will be essential . Finally, the integration of micro metal AM into existing macroscopic AM could advance current attempts to fabricate electronics, actuators and sensors inside macro AM builds . Additionally, the combination of micro and macro metal AM could enable unique features, e.g., an extreme voxel scaling that would permit highly resolved details in critical areas combined with large volume growth rates in less critical sections of a part.…”

Section: Discussionmentioning

confidence: 99%

Additive Manufacturing of Metal Structures at the Micrometer Scale

et al. 2017

View full text Add to dashboard Cite

Currently, the focus of additive manufacturing (AM) is shifting from simple prototyping to actual production. One driving factor of this process is the ability of AM to build geometries that are not accessible by subtractive fabrication techniques. While these techniques often call for a geometry that is easiest to manufacture, AM enables the geometry required for best performance to be built by freeing the design process from restrictions imposed by traditional machining. At the micrometer scale, the design limitations of standard fabrication techniques are even more severe. Microscale AM thus holds great potential, as confirmed by the rapid success of commercial micro-stereolithography tools as an enabling technology for a broad range of scientific applications. For metals, however, there is still no established AM solution at small scales. To tackle the limited resolution of standard metal AM methods (a few tens of micrometers at best), various new techniques aimed at the micrometer scale and below are presently under development. Here, we review these recent efforts. Specifically, we feature the techniques of direct ink writing, electrohydrodynamic printing, laser-assisted electrophoretic deposition, laser-induced forward transfer, local electroplating methods, laser-induced photoreduction and focused electron or ion beam induced deposition. Although these methods have proven to facilitate the AM of metals with feature sizes in the range of 0.1-10 µm, they are still in a prototype stage and their potential is not fully explored yet. For instance, comprehensive studies of material availability and material properties are often lacking, yet compulsory for actual applications. We address these items while critically discussing and comparing the potential of current microscale metal AM techniques.

show abstract

Additive Manufacturing of Hybrid Circuits

Cited by 51 publications

References 96 publications

Manufacturing Dense Thick Films of Lunar Regolith Simulant EAC-1 at Room Temperature

Manufacturing Dense Thick Films of Lunar Regolith Simulant EAC-1 at Room Temperature

Printing Conductive Nanomaterials for Flexible and Stretchable Electronics: A Review of Materials, Processes, and Applications

Additive Manufacturing of Metal Structures at the Micrometer Scale

Contact Info

Product

Resources

About