Additive Processes for Polymeric Materials

Meng, Ellis; Zhang, Xin; Benard, William L.

doi:10.1007/978-0-387-47318-5_4

Cited by 15 publications

(11 citation statements)

References 394 publications

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“…Figure 3d shows that the 1,600 mm-high MSMP-B (72.7 in aspectratio) exhibited deflection amplitude close to 20% of its height under 0.12 m s À 1 airflow. Under the assumption of linearly increasing airflow velocity from the surface, the corresponding sensitivity is 0.25 m Pa À 1 , which is in order-of-magnitude agreement with the sensitivity of the existing PDMS micropillar multiplied by (72.7/20) 5 . To summarize, the present MSMPs exhibit sensitivity comparable to existing PDMS micropillars while bringing in additional advantages of higher aspect-ratios and lower resonance frequencies.…”

Section: Discussionsupporting

confidence: 71%

“…There, the sensitivity was defined as the ratio between the tip deflection amplitude and the wall shear stress and estimated to be B150 mm Pa À 1 for a 200 mm-high micropillar (20 in aspectratio) near 100 Hz. It was also predicted that the sensitivity would increase with the aspect-ratio in proportion to (h/d) 4.5 B(h/d) 5 . Figure 3d shows that the 1,600 mm-high MSMP-B (72.7 in aspectratio) exhibited deflection amplitude close to 20% of its height under 0.12 m s À 1 airflow.…”

Section: Discussionmentioning

confidence: 99%

“…M icropillars made of poly(dimethylsiloxane) (PDMS) have seen rapid expansion in their application scope, from biomimetic dry adhesion 1 and surface wetting control 2 to cell mechanic studies [3][4][5][6] . That scope can be further widened by increasing their height and aspect-ratio.…”

mentioning

confidence: 99%

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Microsphere-assisted fabrication of high aspect-ratio elastomeric micropillars and waveguides

Paek

Kim

2014

Nat Commun

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High aspect-ratio micropillars are in strong demand for microtechnology, but their realization remains a difficult challenge, especially when attempted with soft materials. Here we present a direct drawing-based technique for fabricating micropillars with poly(dimethylsiloxane). Despite the material's extreme softness, our technique enables routine realization of micropillars exceeding 2,000 mm in height and 100 in aspect-ratio. It also supports in situ integration of microspheres at the tips of the micropillars. As a validation of the new structure's utility, we configure it into airflow sensors, in which the micropillars and microspheres function as flexible upright waveguides and self-aligned reflectors, respectively. Highlevel bending of the micropillar under an airflow and its optical read-out enables mm s À 1 scale-sensing resolution. This new scheme, which uniquely integrates high aspect-ratio elastomeric micropillars and microspheres self-aligned to them, could widen the scope of soft material-based microdevice technology.

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Section: Discussionsupporting

confidence: 71%

Section: Discussionmentioning

confidence: 99%

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Microsphere-assisted fabrication of high aspect-ratio elastomeric micropillars and waveguides

Paek

Kim

2014

Nat Commun

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“…PDMS), poly-imides (PI), poly(p-xylene)s (e.g. parylene) and benzocyclobutenes (BCB) [1]. A wide variety of polymers is commercially available and most of them can be deposited and patterned using microlithography techniques (soft lithography, photolithography and direct contact printing) without requiring a harsh etching process (wet etching, reactive ion etching) with the noteworthy exception of poly(p-xylene) deposited by physical vapour deposition.…”

Section: Polymersmentioning

confidence: 99%

Final capping passivation layers for long-life microsensors in real fluids

Vanhove¹,

Tsopela²,

Bouscayrol³

et al. 2013

Sensors and Actuators B: Chemical

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Final capping insulation layer is a critical step in the microfabrication process that determines the lifetime of analytical microsensors in real fluids. Actual processes encounter considerable limitations as (i) organic passivation layers do not provide a satisfying long-term protection against liquids and (ii) inorganic passivation processes (dielectric materials deposition and patterning) are very aggressive for the underlying layers, imposing severe constraints on the integration of sensitive materials. We present here a low temperature deposition process of high quality silicon nitride Si3N4 using ICP-CVD technique combined with a lift-off based process to pattern conformal deposition, in order to avoid harsh treatments such as wet or dry etching.High-density SiNx films with low H content (5 x 10 20 at/cm 3 ) were synthesized at 100°C with controlled uniformity (5%), refractive index (2.025 at 830 nm), etch rate in buffered hydrofluoric acid (8 nm/min), residual stress (-500 MPa), breakdown field (3.9 MV/cm) and dielectric constant (6.0). In order to validate the compatibility of this passivation process with long-term fluids analysis, microelectrodes were fabricated and their lifetime in natural seawater was evaluated. Their active surfaces were defined by patterning the insulation layer. Special care was given to their accurate estimation through the modelling of chronoamperometric curves.Reproducible and stable electrochemical response was obtained for months (> 50 days), demonstrating a considerably extended lifetime in harsh liquid media.

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“…SU-8 has notorious adhesion issues to soda lime substrates. The use of Parylene as an adhesion layer has greatly aided in SU-8 processing on soda lime ( Figure 6) [10][11].…”

Section: Fabrication Process and Mechanical Integritymentioning

confidence: 99%

Improved process for high yield 3D inclined SU-8 structures on soda lime substrate towards applications in optogenetic studies

Kuo

Meng

2012

2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS)

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We report an improved process for backside inclined lithography.The specific improvement is the combination of backside inclined exposure and glycerol medium index matching with a Parylene adhesion layer. This method allows for high aspect ratio SU-8 inclined structures with large surface contact areas on soda lime substrates for optical applications in optogenetic studies. Improved yields over the entire wafer were achieved with improved SU-8 substrate adhesion and perfect gapless contact between the masked substrate and SU-8. The surface roughness of the SU-8 structures is less than 8 nanometers, smooth enough for use as mirrors.

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Additive Processes for Polymeric Materials

Cited by 15 publications

References 394 publications

Microsphere-assisted fabrication of high aspect-ratio elastomeric micropillars and waveguides

Microsphere-assisted fabrication of high aspect-ratio elastomeric micropillars and waveguides

Final capping passivation layers for long-life microsensors in real fluids

Improved process for high yield 3D inclined SU-8 structures on soda lime substrate towards applications in optogenetic studies

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