Adhesion and interface investigation of polyimide on metals

Adhesion of poly(4,4′-oxydiphenylene pyromellitimide) to copper metal using a polymeric primer: Effects of miscibility and polyimide precursor origin

“…In fact, it is well known that adhesion strength in the peel test varies with the mechanical properties of the peeling layer 3,12,26,27) ; in particular, higher modulus gives higher peel strength. For aromatic polyimides, their mechanical properties are also known to vary with the history of precursor origins used in the film formation [28][29][30] .…”

“…In particular, the polyimide exhibits a very poor adhesion to copper metal, so that the polyimide film is easily delaminated from the copper when it is overcoated on copper metal [6][7][8][9][10][11][12][13][14] . Furthermore, its poly(amic acid) precursor was found to react with copper metal during the imidization process, consequently generating copper oxide particles which diffuse into the polyimide film [12][13][14] . The diffusion of copper oxide particles is known to degrade the dielectric properties of the polyimide film 15) .…”

Plasma graft polymerization of vinylimidazole onto Kapton film surface for improvement of adhesion between Kapton film and copper

“…The reaction chamber was evacuated to approximately 0.13 Pa, and then argon gas was introduced into the reaction chamber at a pressure of 13.3 Pa. Afterward, the films were exposed to argon plasma (at an RF input power of 5-100 W) for 5-60 s. Immediately after the plasma exposure, the films were taken from the reaction chamber and exposed to air for [5][6][7][8][9][10] min at room temperature in order to be peroxidized.…”

Reduced copper diffusion in layered silicate/fluorinated polyimide (6FDA‐ODA) nanocomposites

“…Low bulk resistivity (Ն1.67 ⍀ cm) copper (Cu) and low dielectric coefficient (Յ2.8) fluorinated polyimide (PI) are, therefore, suitable choices for forming multilayered structures in these devices. At the Cu/PI interface, however, Cu tends to diffuse into the polyimide, causing leakage currents [1][2][3] and device degradation. Hence, several studies on potential barrier layers have been undertaken.…”

“…One approach involves metal barrier layers such as Ta, Ti, Al, Cr, Ni, W, or various alloys of these metals. [2][3][4][5] The second approach adopts organic materials as barrier layers, such as poly(arylene ether benzimidazole) (PAEBI) or others. 3,6,7 The third approach consists of O 2 and N 2 plasma pretreatment of the polyimide surface.…”