Adhesion characterization of no-flow underfills used in flip chip assemblies and correlation with reliability

Lu, Jicun; Smith, Billy S.; Baldwin, D.

doi:10.1109/6104.924789

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Adhesion characterization of no-flow underfills used in flip chip assemblies and correlation with reliability

Cited by 4 publications

References 8 publications

Effects of underfill materials on the reliability of low-K flip-chip packaging

Effects of underfill materials on the reliability of low-K flip-chip packaging

Die-attach materials for high-density memory stacked die packaging

High performance wafer level underfill material with high filler loading

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