2022
DOI: 10.3390/mi14010037
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Adhesion Evaluation of an Embedded SiN/GaAs Interface Using a Novel “Push-Out” Technique

Abstract: Adhesion assessments of an embedded interface in a multilayer system that contains a ductile layer are challenging. The occurrence of plastic deformation in the ductile layer often leads to additional complexity in analysis. In this study, an innovative “push-out” technique was devised to evaluate the interfacial toughness (Gin) of the embedded SiN/GaAs interface in a Au/SiN/GaAs multilayer system. Focus ion beam (FIB) milling was utilized to manufacture the miniaturized specimen and scratching with a conical … Show more

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