Adhesion issued in epoxy-based chip attach adhesives

Pearson, Raymond A.; Lloyd, Thomas B.; Azimi, H. R.; Hsiung, J. C.; Early, M.S.; Brandenburger, Peter

doi:10.1109/95.558541

Cited by 11 publications

(10 citation statements)

References 8 publications

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“…Results from the three liquid probe test have been published elsewhere [12]. Table I contains results from the two liquid probe test.…”

Section: A Surface Characterizationmentioning

confidence: 98%

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Fracture behavior of isotropically conductive adhesives

Hydro¹,

Pearson²

1999

IEEE Trans. Comp. Packag. Technol.

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The fracture behavior of several commercial, silverfilled epoxies was studied using a combination of fracture mechanics, surface science, and microscopy. Three-point bend tests revealed that the bulk fracture toughness of the silver-filled epoxies fell with a narrow range 1.1-1.3 MPa-m 0:5 . Both electron and optical microscopy studies indicated that crack path deflection due to the silver-particles was the primary micromechanical deformation mechanism. Surprisingly, the interfacial fracture energies between the epoxies and a copper surface ranged from 50 to 900 J/m 2 . Contact angle measurements on the cured epoxies indicated that some epoxy surfaces are more active than others. However, the correlation between thermodynamic work of adhesion and fracture energy is rather weak and suggests only a modest trend. In summary, although the use of contact angles/surface energies to predict adhesion is promising, much more effort is required to make it a reliable screening tool. Fortunately, the use of interfacial fracture mechanics can detect differences in adhesive strength, and should allow packaging engineers to select die attach adhesives with improved adhesion.

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“…Results from the three liquid probe test have been published elsewhere [12]. Table I contains results from the two liquid probe test.…”

Section: A Surface Characterizationmentioning

confidence: 98%

“…For the two liquid probe method, water and diiodomethane are used. For the three liquid probe method, water, diiodomethane, and ethylene glycol are used (see [12] for more details).…”

Section: B Surface Characterizationmentioning

confidence: 99%

Fracture behavior of isotropically conductive adhesives

Hydro¹,

Pearson²

1999

IEEE Trans. Comp. Packag. Technol.

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“…In reflow process, interface cracks which were induced by moisture are very prevalent in plastic packaging devices, especially in lead-free reflow process with higher temperature. Presently, there are many researchers have researched the interface cracks in microelectronics plastic packaging devices: Ferguson [1] had researched the moisture absorption impact of the interface between under-fill epoxy and soldering pad, and pointed out that interface intensity is not only relate to moisture absorption, but also relate to mechanical properties match of materials, load conditions and surface chemical properties of interface; Gektin [2] had researched dry devices and moisture pre-absorption devices under high temperature environment through experiment, the experimental results show that dry devices didn't appear "popcorn" fracture when in reflow process, this prove that the thermal stress in devices isn't the main factor that lead to "popcorn" fracture; Suhling [3] studied the moisture absorption devices in packing process and found that most of those devices appeared "popcorn" fracture, the result show that the main factor of "popcorn" fracture is moisture absorption in devices before high temperature reflow process.…”

Section: Introductionmentioning

confidence: 99%

“…When exposed to certain circumstances, these microelectronics plastic packaging devices are very easy to absorption moisture [1] . In reflow process, interface cracks which were induced by moisture are very prevalent in plastic packaging devices, especially in lead-free reflow process with higher temperature.…”

Section: Introductionmentioning

confidence: 99%

Study of interface reliability in QFN device under hygro-thermal environment

Jiang

Hongmi

2008

2008 International Conference on Electronic Packaging Technology &Amp; High Density Packaging

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The interface crack caused by moisture absorption is a main reason for the failure of plastic packaging electronic devices. According to the failure of interface cracks in QFN plastic packaging devices caused by hytro-thermal environment, the paper combining with Finite Element Method (FEM), carried on the research by moisture absorption experiment, lead-free reflow soldering experiment, high temperature tidal thermal experiment, and Scanning Electron Microscope (SEM) experiment. The results of study show that: non-moisture absorption devices seldom produce cracks after the lead-free reflow soldering, and moisture absorption devices don't produce any crack during absorbing moisture, but they easily produce cracks after lead-free reflow soldering; The cracks produced by the experiment mainly lay on the interface between Die-Attach material (DA) and the chip, and the cracks at the junction of chip, DA material and Epoxy Molding Compound material (EMC) have the greatest damage; The position and the expansion direction of cracks are closely related to the characteristic and the interface intensity of the two connecting materials. These conclusions have important practical significance to the study and the evaluation criterion of crack.

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“…Electrical failures in microelectronics packaging are a direct result of local delamination at one or several of many heterogeneous interfaces [4][5][6]. In addition to thermal excursions, the interfaces also have to withstand any effects of moisture from the humidity in the surrounding environment.…”

Section: Introductionmentioning

confidence: 99%