2022
DOI: 10.2320/matertrans.mt-mc2022001
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Adhesion Mechanism between Mold Resin and Sputtered Stainless Steel Ground Films for Electromagnetic Wave Shield Packages

Abstract: The number of radio systems used for global communications or advanced features is increasing in electronic devices such as smart phones. As mobile information and telecommunications terminals are miniaturized and advanced features are added by manufacturers, measures to prevent electromagnetic interference among electronic components on high-density mounting boards are becoming increasingly important. Therefore, it is crucial to develop methods for forming electromagnetic wave shield films in semiconductor de… Show more

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Cited by 7 publications
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