characteristics enable it to be a promising candidate for powering IoTs. [9][10][11][12][13][14][15] In particular, TENG is expected to be a soft and stretchable device which is highly integrated with human body and motion for powering upcoming era of wearable electronics. The structure of TENG consists of a pair of triboelectrification materials with distinct charge affinities and corresponding back electrodes, which exploits the coupling effect of triboelectrification and electrostatic induction. [16,17] Accordingly, the triboelectrification pairs as well as electrodes are all required with good softness and stretchability to fulfill the goal of soft and stretchable TENG. [18][19][20] Gels possess intrinsic good softness, high stretchability, and good conductivity, which are ideal materials for stretchable electrodes, and many researchers had successfully applied gels as electrodes to fabricate transparent and stretchable TENGs. [21][22][23][24][25][26][27][28] However, different deformations are inevitable in designed application scenarios of flexible electronics, which requires robust structure to suffer the deformations and further keep TENG's output performance. [26,29] Unfortunately, due to the weak interfacial bonding between gel electrodes and triboelectrification elastomers, delamination in gel-based TENG's deformation is a notable problem because it will induce TENG's structural failure. [25,26,30] Moreover, this problem troubles all gel-based devices for flexible electronics, which is not limited to TENG devices. [31][32][33] Given this, researchers have put great endeavors to improve the interfacial bonding for obtaining a more reliable gel-based TENG. The well-accepted method was chemical modification of triboelectrification elastomers' surface, which applied benzophenone or plasma with coupling reagent to form chemical conjunction with gel electrodes. [32][33][34][35] The chemical conjunction was tough and the bonding strength can surpass gels' tensile strength. The gel-based devices thus can undergo deformations without delamination. However, this method required more chemical steps, implying a much more complicated way. Some researchers employed adhesive gels or altered the triboelectrification materials for naturally intimate interactions between gel layers and triboelectrification layers to avoid the additional complicated chemical modification. [36,37] Nonetheless, this method was only suitable for certain material pairs, not a general method for obtaining tough bonding Gel-based triboelectric nanogenerator (TENG) has demonstrated promising potentials in stretchable electronics owing to gel electrodes' intrinsic softness, stretchability, and conductivity. However, delamination between gel and elastomer layers in deformations remains a considerable challenge for gel-based TENG, which most often induces structure failure. Herein, gels are regarded as adhesives and further effectively enhances interfacial bonding strength by a rough interface in adhesives' view, which exploits gels' liquid-tosoli...