Adhesion of polymer/metal bonds for molded interconnect devices (MID)

Paproth, A.; Wolter, Klaus‐Jürgen; Deltschew, R.

doi:10.1109/isse.2005.1491047

Cited by 4 publications

(2 citation statements)

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In later processing, a thick layer of SU-8 epoxy, which will act as a membrane, was deposited on the thermopile structure figure 2(c). A short oxygen plasma etch was performed in order to enhance the adhesion between the SU-8 and the metals [19].…”

Section: Fabrication Of the Detectormentioning

confidence: 99%

Integration of an interferometric IR absorber into an epoxy membrane based CO₂detector

et al. 2014

View full text Add to dashboard Cite

Measurements of carbon dioxide levels in the environment are commonly performed by using non-dispersive infrared technology (NDIR). Thermopile detectors are often used in NDIR systems because of their non-cooling advantages. The infrared absorber has a major influence on the detector responsivity. In this paper, the fabrication of a SU-8 epoxy membrane based Al/Bi thermopile detector and the integration of an interferometric infrared absorber structure of wavelength around 4 µm into the detector is reported. The membrane of thermopile detector has been utilized as a dielectric medium in an interferometric absorption structure. By doing so, a reduction in both thermal conductance and capacitance is achieved. In the fabrication of the thermopile, metal evaporation and lift off process had been used for the deposition of serially interconnected Al/Bi thermocouples. Serial resistance of fabricated thermopile was measured as 220 kΩ. The response of fabricated thermopile detector was measured using a visible to infrared source of radiation flux 3.23 mW mm −2 . The radiation incident on the detector was limited using a band pass filter of wavelength 4.26 µm in front of the detector. A responsivity of 27.86 V mm 2 W −1 at room temperature was achieved using this setup. The fabricated detector was compared to a reference detector with a broad band absorber. From the comparison it was concluded that the integrated interferometric absorber is functioning correctly.

show abstract

Section: Fabrication Of the Detectormentioning

confidence: 99%

Integration of an interferometric IR absorber into an epoxy membrane based CO₂detector

et al. 2014

View full text Add to dashboard Cite

show abstract

“…Investigations into laser patterning technologies on 3D-MID and surface-mount devices (SMD) and bare die assembling with different substrates were conducted [6]. Adhesive strength between polymer and metals was studied with surface improvement by plasma treatment [7]. Investigation on deposition of a Cu/Cr layer on thermoplastic substrates was carried out with different plasma pretreatment processes.…”

Section: Introductionmentioning

confidence: 99%

Effect of Weld Line Formation on Morphology and Mechanical Properties for 3D-MID Technology

Chuaping¹,

Mann²,

Dangtungee

et al. 2015

KEM

View full text Add to dashboard Cite

The topic of this research work was to demonstrate the feasibility of a 3D-MID concept using injection molding technique and investigate the effects of two weld line types on the structure and mechanical properties such as tensile, flexural strength and morphology. In order to obtain more understanding of the bonds between polymer and metals, two different polymer bases of polyphthalamide (PPA) with the same type and amount of filler content were produced by injection molding at the different processing conditions. A mold was designed in such a way that weld and meld line can be produced with different angles by changing as insert inside of the mold. The mechanical properties such as stiffness, tensile strength and flexural strength were determined in tensile and flexural tests, respectively. The results showed in line with the expectation of high reduction on mechanical properties in area where weld/meld lines occurred. The result of tensile test was clearly seen that weld and meld line showed a considerable influence on mechanical properties. The reduction in tensile strength was approximately 58% according to weld line types, whereas in flexural strength was approximately 62%. On the other hand, the effect of the injection times and mold temperatures on the tensile strength were marginal.

show abstract

Adhesion of Metal/Polymer Bonds using PBT, PC, PS and Copper

Paproth

Wolter²,

Deltschew³

56th Electronic Components and Technology Conference 2006

View full text Add to dashboard Cite

Adhesion of polymer/metal bonds for molded interconnect devices (MID)

Cited by 4 publications

References 1 publication

Integration of an interferometric IR absorber into an epoxy membrane based CO₂detector

Integration of an interferometric IR absorber into an epoxy membrane based CO₂detector

Effect of Weld Line Formation on Morphology and Mechanical Properties for 3D-MID Technology

Adhesion of Metal/Polymer Bonds using PBT, PC, PS and Copper

Contact Info

Product

Resources

About

Adhesion of polymer/metal bonds for molded interconnect devices (MID)

Cited by 4 publications

References 1 publication

Integration of an interferometric IR absorber into an epoxy membrane based CO2detector

Integration of an interferometric IR absorber into an epoxy membrane based CO2detector

Effect of Weld Line Formation on Morphology and Mechanical Properties for 3D-MID Technology

Adhesion of Metal/Polymer Bonds using PBT, PC, PS and Copper

Contact Info

Product

Resources

About

Integration of an interferometric IR absorber into an epoxy membrane based CO₂detector

Integration of an interferometric IR absorber into an epoxy membrane based CO₂detector