Adhesion Property Between Cu, Ti Metal and SU-8, AZ 4620 Polymer Dielectric

Huang, Yen Jun; Hsieh, Y. H.; Shih, Jian Yu; Chen, Han Chun; Perng, Leu-Jih; Chen, Kuan‐Neng

doi:10.1166/jnn.2016.12596

Cited by 6 publications

(1 citation statement)

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“…However, the interface bonding between a polymer and silicon (Si) or metal is poor, especially between a polymer and metal. When using polymer to fabricate microstructures or microdevices on a metal substrate, the adhesion strength between the polymer and substrate is much lower than that on the Si substrate [ 19 ], which will have a great impact on the final quality and performance of the designed structure. The polymer and substrate are prone to bond failure due to the poor adhesion performance between the polymer and metal materials.…”

Section: Introductionmentioning

confidence: 99%

Preparation of Highly Stable Polymer Microstructure with Enhanced Adhesion Strength by Pushpin-like Nano/Microstructure Array

Ding

et al. 2023

Polymers

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This polymer microstructure expands more available application, which is a milestone for the development of micro-electro-mechanical system devices towards intelligence and multifunction. Poor interface bonding between the polymer and Si or metal is a particular problem, which restricts the application and promotion of polymer materials. In this study, a transition strengthening layer is proposed to obtain a highly stable polymer microstructure by enhancing the interfacial adhesion strength. The transition strengthening layer is activated by a pushpin-like nano/microstructure array with micromachining technology. Given its good graphical qualities and compatibility, epoxy negative photoresist SU-8 is applied to evaluate the strengthened capabilities of the pushpin-like nano/microstructure array. The microstructure of SU-8 is prepared by the same processes, and then the adhesion strength between the SU-8 microstructure and various activated substrates is tested by the thrust tester. It was determined that SU-8 with an activated pushpin-like microstructure array possessed a highly stable adhesion ability, and its adhesion strength increased from 6.51 MPa to 15.42 MPa. With its ultrahigh stable adhesion ability, it has been applied in fabricating three typical microstructures (hollow square microstructure, gradually increasing adjacent periodic microstructure, and slender strip microstructures) and large-area SU-8 microstructures to evaluate the feasibility of the transition strengthening layer and repeatability and universality of the microfabrication processes. The drifting and gluing phenomenon are avoided by this method compared with the traditional design. The proposed pushpin-like nano/microstructure array is promising in enhancing the stability of polymer microstructures with a substrate.

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Section: Introductionmentioning

confidence: 99%

Preparation of Highly Stable Polymer Microstructure with Enhanced Adhesion Strength by Pushpin-like Nano/Microstructure Array

Ding

et al. 2023

Polymers

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Study on the interfacial bonding mechanism of nano‐injection molding PPS/PA6@Al: A molecular dynamics simulation study

Liu,

Zhang

et al. 2024

Polymer Engineering & Sci

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Nano‐injection molding technology is widely used in producing lightweight and high‐strength composites. In this study, seven polymer‐metal interfacial models with inverted trapezoidal nano‐slots were constructed using the polymers polypropylene sulfide (PPS), polyamide 6 (PA6), and the metal aluminum (Al), where the formula ratio of PPS/PA6 is different. Molecular dynamics simulation was used to analyze the PPS/PA6 motion behavior and interfacial bonding mechanism during the nano‐injection molding process of the PPS/PA6 blend modification. The results indicated that the addition of strongly polarized PA6 to the inert material PPS could effectively enhance the interfacial bond strength of PPS/Al. Because the strong polar amide group in PA6 increased the force between the molecular chain and the metal surface, which led to more anchors forming between the interfaces, the number of anchors at the heterogeneous interfaces increased with the increase of PA6 content. In the interfacial damage simulations, adding PA6 enhanced the interfacial bonding energy, which required greater loading stresses to disengage the anchored molecular chains from the interface.Highlights Strongly polarized amide groups in PA6 enhance the forces. Addition of strongly polar PA6 gets higher interfacial energy and filling ratio. Failure modes: Y‐shear and Z‐tensile.

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Exploring the Correspondence Between Chemical States and Adhesion Property for Cr, Co Metal/AZ 4620, BCB Polymer Interface

Hsieh

Huang

Shih

et al. 2018

IEEE Trans. Compon., Packag. Manufact. Technol.

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Adhesion Property Between Cu, Ti Metal and SU-8, AZ 4620 Polymer Dielectric

Cited by 6 publications

References 0 publications

Preparation of Highly Stable Polymer Microstructure with Enhanced Adhesion Strength by Pushpin-like Nano/Microstructure Array

Preparation of Highly Stable Polymer Microstructure with Enhanced Adhesion Strength by Pushpin-like Nano/Microstructure Array

Study on the interfacial bonding mechanism of nano‐injection molding PPS/PA6@Al: A molecular dynamics simulation study

Exploring the Correspondence Between Chemical States and Adhesion Property for Cr, Co Metal/AZ 4620, BCB Polymer Interface

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