Adhesive Bonding

Brockmann, Walter; Geiß, Paul Ludwig; Klingen, Jürgen; Schröder, Bernhard

doi:10.1002/9783527623921

Cited by 97 publications

(55 citation statements)

References 0 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…Adhesive bonding can be easily integrated into most industrial sequences allowing great flexibility in terms of design and production [80]. Also, with such technique, large surface areas can be joined together.…”

Section: Adhesives Joiningmentioning

confidence: 99%

Welding and Joining of NiTi Shape Memory Alloys: A Review

Oliveira

Miranda

Fernandes

2017

Progress in Materials Science

285

View full text Add to dashboard Cite

Section: Adhesives Joiningmentioning

confidence: 99%

Welding and Joining of NiTi Shape Memory Alloys: A Review

Oliveira

Miranda

Fernandes

2017

Progress in Materials Science

285

View full text Add to dashboard Cite

“…A key element is the reproducible surface preparation prior to bonding [1]. Contrary to metallic materials, the production method of CFRP structures has a big influence on the near surface material composition and, hence, the applicability of surface treatment processes.…”

mentioning

confidence: 99%

The Use of Peel Ply as a Method to Create Reproduceable But Contaminated Surfaces for Structural Adhesive Bonding of Carbon Fiber Reinforced Plastics

Holtmannspötter¹,

Czarnecki²,

Wetzel³

et al. 2013

The Journal of Adhesion

View full text Add to dashboard Cite

In the fabrication of fiber-reinforced plastics materials peel plies are commonly used as an additional layer on top of the laminates to sponge up the surplus resin and to create an activated surface for adhesive bonding or coating by peel ply removal. In theory, the peel ply removal results in a new and uncontaminated fracture surface that is activated by polymer chain scission. The peel ply method is often presented as being a good surface treatment for structural bonding.In this study carbon fiber-reinforced plastics (Hexcel 1 8552= IM7) were produced by the use of five different peel plies and a release foil made of polytetrafluorethylene (PTFE). The peel plies themselves and the surfaces on the CFRP created by peeling were examined by scanning electron microscopy (SEM), x-ray photo electron spectroscopy (XPS), energy-dispersive x-ray spectroscopy (EDX), infrared (IR) spectroscopy, atomic force microscopy (AFM), and contact angle measurements to characterize the surfaces produced. Furthermore, the bond strength of lap shear and floating roller peel samples was determined with and without additional plasma treatment. For bonding, a room temperaturecuring two-component-epoxy adhesive (Hysol 1 9395) was used

show abstract

“…[1][2][3] Typically a glue is applied to bond two materials. In this case, the two materials do not adhere directly to each other via bond formation, but adhere through the glue.…”

Section: Introductionmentioning

confidence: 99%

Direct covalent bond formation between materials using copper(i)-catalyzed azide alkyne cycloaddition reactions

2015

View full text Add to dashboard Cite

Copper(I)-catalyzed azide alkyne cycloaddition (CuAAC) reactions have been used to prepare organic molecules and polymeric materials, however direct adhesion between polymeric materials and between polymeric and inorganic materials via irreversible reactions has not been reported, except for reversible adhesion using some reversible reactions. Herein we realize direct adhesion of materials using the CuAAC reaction in which a poly(acrylamide) gel (pAAm gel) modified with a pendent terminal ethynyl group (E-gel) selectively adheres to the pAAm gel with a pendent azide group (Az-gel). The E-gel selectively bonds to a glass substrate whose surface is modified with the azide groups, but the adhesion strength depends on the ratio of the functional groups. These results indicate that direct adhesion using the CuAAC reaction should be applicable to various environments regardless of the materials' quality. Figure 5. Adhesion between the E-gel(10) and the Az-Sub. (a) Adhered E-gel(10)/Az-Sub object using the CuAAC reaction is immersed in DMSO. E-gel(10) remains on the Az-Sub after soaking in DMSO. (b) Adhered E-gel(10)/Az-Sub object using a cyanoacrylate adhesive immersed in DMSO. E-gel(10) is dropped from the Az-Sub after soaking in DMSO.

show abstract

Adhesive Bonding

Cited by 97 publications

References 0 publications

Welding and Joining of NiTi Shape Memory Alloys: A Review

Welding and Joining of NiTi Shape Memory Alloys: A Review

The Use of Peel Ply as a Method to Create Reproduceable But Contaminated Surfaces for Structural Adhesive Bonding of Carbon Fiber Reinforced Plastics

Direct covalent bond formation between materials using copper(i)-catalyzed azide alkyne cycloaddition reactions

Contact Info

Product

Resources

About