Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
DOI: 10.1007/0-387-32989-7_39
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Adhesive Bonding of Passive Optical Components

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Cited by 1 publication
(2 citation statements)
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“…Epoxy gluing is a favorite means to bond a passive photoelectron device together (Pliska and Bosshard, 2007). Compared to laser welding or soldering, the epoxy glue has a lot of merits, such as a variety of forms, flexible operations, adapting to various complex interface structure, yet without a premetal sleeve round a fiber.…”
Section: Ce Calculations After Adhesive Dispensedmentioning
confidence: 99%
See 1 more Smart Citation
“…Epoxy gluing is a favorite means to bond a passive photoelectron device together (Pliska and Bosshard, 2007). Compared to laser welding or soldering, the epoxy glue has a lot of merits, such as a variety of forms, flexible operations, adapting to various complex interface structure, yet without a premetal sleeve round a fiber.…”
Section: Ce Calculations After Adhesive Dispensedmentioning
confidence: 99%
“…Once the adjustment is completed, the optical components must be held together by adhesive, solder, or welder attachment techniques. As its flexibility, easy-handle and high reliability, adhesive gluing (such as epoxy) is widely used in 90% photonic device packaging (Pliska and Bosshard, 2007). After adhesive gluing, how to estimate the coupling efficiency accurately is becoming of great importance.…”
Section: Introductionmentioning
confidence: 99%