2006
DOI: 10.1109/tadvp.2005.850505
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Adhesive Joint Design for Minimizing Fiber Alignment Shift During UV Curing

Abstract: In fiber-optic device packaging using UV curable adhesive bonding, the curing process often causes fiber alignment shift-distortion of the already aligned fiber-optic setups, and thus reduce the assembly yield. A new method for the adhesive joint design for minimizing fiber alignment shift during adhesive curing is reported in this paper. It is demonstrated that for any adhesive, the bonding joint can be designed to alleviate the alignment shift, regardless of adhesives used. The approach provides guideline fo… Show more

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Cited by 8 publications
(3 citation statements)
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“…When the optimal position is found, the fiber is fixed to the chip, usually by UV-curing adhesive [2]. However, adhesives are prone to shrinkage during or after the curing process, which causes misalignment after the final bonding step [8]. Therefore, there is a need for alignment methods to (re)align the fiber actively by an actuator integrated in the device.…”
Section: Introductionmentioning
confidence: 99%
“…When the optimal position is found, the fiber is fixed to the chip, usually by UV-curing adhesive [2]. However, adhesives are prone to shrinkage during or after the curing process, which causes misalignment after the final bonding step [8]. Therefore, there is a need for alignment methods to (re)align the fiber actively by an actuator integrated in the device.…”
Section: Introductionmentioning
confidence: 99%
“…The stress is generated in the waveguide materials mainly due to the thermal expansion mismatch among the constituent materials. In polymer based optical waveguides, the stress can also be generated due to the polymerization shrinkage even at room temperature when cured under UV light [5]. Due to the photoelastic effect, this stress may cause anisotropic changes in the material refractive index (i.e., material birefringence), which then makes the device polarization dependent [4].…”
Section: Introductionmentioning
confidence: 99%
“…When the optimal position is found, the fiber is fixed to the chip, usually by UV-curing adhesive [2]. However, the adhesives are prone to shrinkage during and/or after the curing process, which causes misalignment after the final bonding step [8]. Other joining methods, such as welding, soldering and clamping lead to similar kind of misalignment problems due to inherent stress.…”
Section: Mathematical Notationmentioning
confidence: 99%