Adsorption of Pd nanoparticles catalyst in high aspect ratio through-Si vias for electroless deposition

Inoue, Fumihiro; Shimizu, Tomohiro; Miyake, Hiroshi; Arima, Ryohei; Iwamoto, Toshihiko; Seki, Hirofumi; Shinozaki, Yuko; Yamamoto, Tomohiko; Shingubara, Shoso

doi:10.1016/j.electacta.2012.04.165

Cited by 15 publications

(10 citation statements)

References 30 publications

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“…ions were then reduced to Pd by the adsorbed Sn 2? , when the pretreated PET sheets successively in a SnCl 2 solution then in an PdCl 2 solution [14,21,26]. Reasonably, the generated Pd nano-particles that served as seeds to catalyze the electroless nickel plating on the PET surface.…”

Section: Resultsmentioning

confidence: 99%

Method for electroless nickel plating on poly(ethylene terephthalate) substrate modified with primer and self-assembled monolayer

Sun

Huang

Wang³

et al. 2015

J Mater Sci: Mater Electron

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In this work, the electroless nickel plating on poly(ethylene terephthalate) (PET) surface was developed based on printing primer and then immersing in 3-aminopropyltriethoxysilane (KH550) solution. The mechanism of the surface activating and structural properties of nickel plating were investigated using Fourier transform infrared spectroscopy, Hall measurements, optical microscope and T-peel adhesion strength. Results showed the formation of crystalline Ni and Ni-P coatings on the pretreated PET surface. The surface electrical resistivity of nickel coating was reduced from 12.18 to 0.09 ohm cm, and the adhesion strength were 9.74-9.89 N/cm, when the deposited time increased from 1 to 30 min. The average electromagnetic interference-shielding effectiveness of nickel-plated PET sheets maintained a relatively stable value (38.4-37.5 dB) in a frequency range of 0.05-1.5 GHz. The electroless nickel plating was most possibly due to the formation of higher density of carboxyl groups and then graft copolymerization of amine groups onto the pretreated PET surface. Therefore, the pretreated PET surface was more prone to absorb tin sensitizer and palladium catalyst to form an active layer for electroless nickel plating.

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Section: Resultsmentioning

confidence: 99%

Method for electroless nickel plating on poly(ethylene terephthalate) substrate modified with primer and self-assembled monolayer

Sun

Huang

Wang³

et al. 2015

J Mater Sci: Mater Electron

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“…The density of palladium nanoparticles distributed on 3-aminopropyl-triethoxysilane (APTES)-modified silicon substrates has been demonstrated to be higher than that on substrates treated with a conventional tin/palladium (Sn/Pd) colloid. (9) The increased palladium density improves the adherence of electroless plating films on silicon oxide (SiO 2 /Si) wafers. When APTES is used to modify a SiO 2 /Si wafer, the electroless plating film applied in deep through-silicon vias has favorable conformity and strong adhesion as a barrier layer against copper diffusion.…”

Section: Introductionmentioning

confidence: 99%

“…When APTES is used to modify a SiO 2 /Si wafer, the electroless plating film applied in deep through-silicon vias has favorable conformity and strong adhesion as a barrier layer against copper diffusion. (9,10) Self-assembled layers of aminosilanes have been used to bind nanoparticle catalysts for electroless deposition on SiO 2 /Si wafers. The influence of the aminosilane structure on deposit adherence is unclear.…”

Section: Introductionmentioning

confidence: 99%

Influence of Aminosilane Self-assembled Layers on the Adhesion of Electroless Nickel–Phosphorus on a Silicon Wafer

Lin¹,

Chu²,

Chang³

et al. 2021

Sensors and Materials

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Self-assembled layers of aminosilane have been used to bind nanoparticle catalysts for electroless deposition on silicon wafers. However, the influence of accessible amino groups on aminosilane on the adhesion of nickel-phosphorus (Ni-P) deposits has not yet been determined. In this study, we deposited (3-aminopropyl)trimethoxysilane, N-(2-aminoethyl)-3aminopropyltrimethoxysilane, and 3-(trimethoxysilylpropyl)diethylenetriamine as coupling layers between Ni-P films and silicon substrates. We explored the influence of different aminosilanes on the distribution of the catalysts and the adherence of electroless Ni-P films. The surface morphology, composition, and hardness of Ni-P films formed on the different aminosilanes were thoroughly examined. The results indicate that 3-(trimethoxysilylpropyl) diethylenetriamine can bind to the largest number of nanoparticles, but the lack of anchoring sites and catalyst aggregation accounted for the poor adhesion of the Ni-P film deposited on it.

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“…22) We proposed an all-wet TSV metal filling process using a Pd nanoparticle catalyst, when electroless barrier metal deposition, electroless Cu seed layer deposition, and finally TSV filling with bottom-up electroplating of Cu. [23][24][25][26][27] We performed the conformal deposition of both the barrier metal and the Cu seed layer by electroless plating in a TSV with an aspect ratio of more than 10. For the formation of electroless barrier metal layers on SiO 2 , which exists on the sidewall as well as on the bottom of the TSV, we need to form Pd catalyst layers.…”

Section: Introductionmentioning

confidence: 99%

“…We found that Pd nanoparticles (4 nm diameter, Tanaka precious metal) had excellent properties when they were used in high-aspect-ration TSVs. 26,27) There was no agglomeration of Pd nanoparticles and they tended to form a mono layer by adsorption on a selfassembled monolayer (SAM) of 3-aminopropyl triethoxysilane (APTES) coupled to a SiO 2 underlayer.…”

Section: Introductionmentioning

confidence: 99%

Evaluation of the interdiffusion properties of Cu and electroless-plated CoWB barrier films formed on silicon substrate

Iseri

Shindo

Miyachi

et al. 2018

Jpn. J. Appl. Phys.

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Electroless-plated films have the desirable property of conformal deposition on dielectric under layers. Therefore, electroless plated (ELP) barrier metals are promising, for preventing Cu atom diffusion into SiO2 and Si in through-silicon vias (TSVs) used for three-dimensional (3D) integration. In this study, we evaluated Cu inter-diffusion properties after annealing at 400 °C for electroless-plated CoB and CoWB barrier layers with different W contents (0, 12.3, and 20.8%) formed on thin SiO2/Si substrate. The secondary ion mass spectrometry (SIMS) depth profile and cross-sectional TEM analysis of the TiN/Cu/ELP Co alloy/thin SiO2 (5 nm)/Si stacked films suggest that a CoWB film with a larger W content has a better effect on suppressing Cu inter-diffusion. It is demonstrated that ELP-CoWB having a large amount of W is a promising barrier layer for high-aspect TSVs used for 3D integration.

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Adsorption of Pd nanoparticles catalyst in high aspect ratio through-Si vias for electroless deposition

Cited by 15 publications

References 30 publications

Method for electroless nickel plating on poly(ethylene terephthalate) substrate modified with primer and self-assembled monolayer

Method for electroless nickel plating on poly(ethylene terephthalate) substrate modified with primer and self-assembled monolayer

Influence of Aminosilane Self-assembled Layers on the Adhesion of Electroless Nickel–Phosphorus on a Silicon Wafer

Evaluation of the interdiffusion properties of Cu and electroless-plated CoWB barrier films formed on silicon substrate

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