2012
DOI: 10.1039/c2ra21659k
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Advanced bimetallic In–Cu/Ag/Au nanostructures via microemulsion-based reaction

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Cited by 24 publications
(25 citation statements)
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“…[36] First of all, In 0 nanoparticles were obtained by the reduction of InCl 3 4H 2 Ow ith NaBH 4 in astandard ME (water, n-dodecane,CTAB, 1-hexanol). Such ao ne-pot synthesis can significantly facilitate the experimental handling, while at the same time agglomeration and/or decomposition of the eventually reactive intermediate nanoparticles can be efficiently avoided.…”
Section: Follow-up Reactionsmentioning
confidence: 99%
See 1 more Smart Citation
“…[36] First of all, In 0 nanoparticles were obtained by the reduction of InCl 3 4H 2 Ow ith NaBH 4 in astandard ME (water, n-dodecane,CTAB, 1-hexanol). Such ao ne-pot synthesis can significantly facilitate the experimental handling, while at the same time agglomeration and/or decomposition of the eventually reactive intermediate nanoparticles can be efficiently avoided.…”
Section: Follow-up Reactionsmentioning
confidence: 99%
“…Such follow-up reactions are here demonstrated for In 0 nanoparticles. [36] First of all, In 0 nanoparticles were obtained by the reduction of InCl 3 4H 2 Ow ith NaBH 4 in astandard ME (water, n-dodecane,CTAB, 1-hexanol). First, InCl 3 4H 2 Ow as dissolved in the aqueous droplet phase.T hereafter,N aBH 4 was injected as an aqueous solution into the ME to act as the reducing agent ( Figure 7).…”
Section: Follow-up Reactionsmentioning
confidence: 99%
“…Using the procedure described in Ref. 17, the composition and thickness of the shell and core can be extracted. The evaluation yields an outer shell of about 6 nm thickness with an average chemical composition of Bi 0.37 ± 0.07 Te 0.63 ± 0.07 , which agrees well with the expected composition of Bi 2 Te 3 (Figure 5c).…”
Section: Resultsmentioning
confidence: 99%
“…The composition of different regions of a nanorod was then determined following the procedure described in detail in Ref. 17.…”
Section: Methodsmentioning
confidence: 99%
“…The IMCs can effectively prompt a remarkable influence on the structural stiffness and material strengths of solder joints, which are significant to the reliability performance of the microelectronic packaging [14]. In literature, extensive investigations have put their focus on the interfacial formation and evolution of AgIn 2 and Ag 3 In IMCs [11,[13][14][15][16][17][18][19][20]. It is worth noting that prior to the successful application of the Pb-free solder in the advanced interconnect technology, it is very crucial to thoroughly grasp the physical properties of the IMCs for further comprehension of the solder joint reliability.…”
Section: Introductionmentioning
confidence: 99%