2011 International Electron Devices Meeting 2011
DOI: 10.1109/iedm.2011.6131657
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Advanced channel engineering achieving aggressive reduction of V<inf>T</inf> variation for ultra-low-power applications

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Cited by 39 publications
(13 citation statements)
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“…The peak concentrations of the threshold voltage adjustment and screening layers are taken to be 3×10 18 cm -3 and 3×10 19 cm -3 respectively. The poly gate concentration is selected to obtain the desired T V as reported in [4]. The channel length is taken to be 45 nm.…”
Section: Device Structures and Simulation Setupmentioning
confidence: 99%
“…The peak concentrations of the threshold voltage adjustment and screening layers are taken to be 3×10 18 cm -3 and 3×10 19 cm -3 respectively. The poly gate concentration is selected to obtain the desired T V as reported in [4]. The channel length is taken to be 45 nm.…”
Section: Device Structures and Simulation Setupmentioning
confidence: 99%
“…Increasing the dosage of impurities in the channel raises V th and lowers the sub-threshold current. Unlike dopant changes, an increase in the impurities makes RDF worse and increases junction leakage [78]. A DDC technology for 65nm [79][78] is designed to optimize the trade-off between V th variation and sub-threshold leakage.…”
Section: Ddc Technologymentioning
confidence: 99%
“…Figure 5.11 shows the TEM representation of a 55nm ULL Figure 5.10: Impact of increase in Gate-Oxide (T OX ) on V th variation [11] device in DDC technology. The un-doped channel and highly doped screen layer reduce V th variation in DDC [78]. The ULL device using DDC further reduces leakage using an optimal selection of channel lengths combined with body biasing.…”
Section: Ddc Technologymentioning
confidence: 99%
“…The authors in [35] addressed the limitation of voltage scaling in bulk-CMOS by using extremely thin Silicon-On-Insulator SOI (ETSOI) for low-power applications. The ETSOI [35] and Tri-gate FET [36] structures with selectively grown epitaxial channels after shallow trench isolation (STI) improve performance but do not address V T variation due to RDF [37,38]. None of these technological advancements allow a 6T SRAM to operate in the subthreshold region or address subthreshold challenges stated in [2] and [24].…”
Section: Technology Considerationmentioning
confidence: 99%
“…The triple well structure in DDC allows RBB to accentuate the inherent benefits of ULL devices for extra power savings at low V DD . As shown in Equation (1.1), the source-to-body biasing (V SB ) controls the V T [38,41]. The device is reverse body biased (RBB) by applying a negative voltage to the bulk in the case of NMOS and applying > V DD voltage to the bulk of the PMOS to increase the V T .…”
Section: Body Biasing: Leakage Minimization and Reliability Challengementioning
confidence: 99%