2004
DOI: 10.1179/026708404225010702
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Advanced Coatings through Pulsed Magnetron Sputtering

Abstract: Pulsed magnetron sputtering (PMS) has become established as the process of choice for the deposition of dielectric materials for many applications. The process is attractive because it offers stable arc free operating conditions during the deposition of, for example, functional films on architectural and automotive glass, or antireflective/antistatic coatings on displays. Recent studies have shown that pulsing the magnetron discharge also leads to hotter and more energetic plasmas in comparison with continuous… Show more

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Cited by 36 publications
(13 citation statements)
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“…Similar results have also been obtained for TiAlN coatings [5]. The improvement in tribological properties was attributed to structural modifications arising from the enhanced deposition conditions now known to occur in the PMS process [6][7][8].…”
Section: Introductionsupporting
confidence: 79%
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“…Similar results have also been obtained for TiAlN coatings [5]. The improvement in tribological properties was attributed to structural modifications arising from the enhanced deposition conditions now known to occur in the PMS process [6][7][8].…”
Section: Introductionsupporting
confidence: 79%
“…Titanium nitride coatings were deposited by pulsed reactive unbalanced magnetron sputtering in a Teer Coatings Ltd. UDP350 rig [4][5][6]. For comparison purposes, coatings were also deposited by continuous DC reactive sputtering.…”
Section: Methodsmentioning
confidence: 99%
“…The metal-support interaction is ensured by defects of the support surface. Therefore, the most suitable synthesis methods are those which use nonequilibrium processes to produce structures with high density of defects: burning a precursor solution (solution-combustion) [21,22], spraying in a flame (spray pyrolysis) [23,24], atomization in electric discharge [25,26] or laser evaporation [27][28][29]. Pulsed laser ablation (PLA) in liquid phase is a simple and environmentally friendly method for obtaining dispersions of particles with a high density of defects.…”
Section: Introductionmentioning
confidence: 99%
“…However, during WO 3 film deposition by using DC magnetron sputtering an electrically insulating layer is built up on the surface of the target which leads to arcing due to charge accumulation. In this case, the WO 3 target is fused and only sputtered within a small region of the target surface; hence defects in the deposited layer are likely to be created [17]. This problem can be overcome by using pulsed DC sputtering since the accumulated charge of insulating layers is neutralized easily during the change in polarity of a pulse and thereby the reduction in the arcing event.…”
Section: Introductionmentioning
confidence: 99%
“…This problem can be overcome by using pulsed DC sputtering since the accumulated charge of insulating layers is neutralized easily during the change in polarity of a pulse and thereby the reduction in the arcing event. It consequently prevents deterioration of film properties and the deposition process also remains stable [17]. Thus, the defect-free WO 3 thin films with superior uniformity, quality, and specific microstructure can be deposited by pulsed DC magnetron sputtering.…”
Section: Introductionmentioning
confidence: 99%