“…With the increase in T on discharge energy in a single pulse increases, causing more heat transfer into the wafering zone resulting in a rise in wafering speed. 37 With an increase in T off , the time gap between two consecutive sparks decreases, resulting in a reduction in discharge energy per unit time and a decrease in wafering speed. 38 Figure 4.Effect plots for wafering speed.…”
Monocrystalline silicon wafers are widely used as the primary material for solar cell production in the photovoltaic industry, owing to their high efficiency and sleeker aesthetic. Wafering is the primary process towards wafer production. The existing wafering processes have limitations of cracking, chipping, and high kerf loss, arising the need for cost-efficient and precise methods to produce wafers. In the present experimental work, an attempt has been made to explore the potential of Wire Electro-discharge Machining (WEDM) for wafer production and to gain an understanding of the effects caused by pulse on time (Ton), pulse off time (Toff), peak current (Ip), wire tension (WT), and wire feed rate (WFR) during the wafering process to achieve the optimal parametric setting for attaining maximum wafering speed and minimum surface roughness. The work material used was P-type monocrystalline silicon. Wafers thickness of 250 μm was produced, avoiding edge chipping. The experimentation was planned according to the face-centered central composite design. The obtained results were statistically analyzed, and response surface methodology (RSM) was used to model the wafering speed and surface roughness. From the analysis of experimental results, it was noticed that at the higher level of Ton and Ip, a maximum wafering speed of 2.574 mm/min was attained. In contrast, the minimum surface roughness of 1.57 μm was achieved at the lower level of Ton and Ip. The most significant process variables that influence the wafering speed and surface roughness are the Ton, Toff, and Ip. Micrographs of the wafer surface reveal the presence of micro craters, but there was no evidence of micro-cracks. The multi-objective optimization of the responses was done using the desirability approach, and the optimized values of wafering speed and surface roughness attained were 0.989 mm/min and 1.57 μm, respectively.
“…With the increase in T on discharge energy in a single pulse increases, causing more heat transfer into the wafering zone resulting in a rise in wafering speed. 37 With an increase in T off , the time gap between two consecutive sparks decreases, resulting in a reduction in discharge energy per unit time and a decrease in wafering speed. 38 Figure 4.Effect plots for wafering speed.…”
Monocrystalline silicon wafers are widely used as the primary material for solar cell production in the photovoltaic industry, owing to their high efficiency and sleeker aesthetic. Wafering is the primary process towards wafer production. The existing wafering processes have limitations of cracking, chipping, and high kerf loss, arising the need for cost-efficient and precise methods to produce wafers. In the present experimental work, an attempt has been made to explore the potential of Wire Electro-discharge Machining (WEDM) for wafer production and to gain an understanding of the effects caused by pulse on time (Ton), pulse off time (Toff), peak current (Ip), wire tension (WT), and wire feed rate (WFR) during the wafering process to achieve the optimal parametric setting for attaining maximum wafering speed and minimum surface roughness. The work material used was P-type monocrystalline silicon. Wafers thickness of 250 μm was produced, avoiding edge chipping. The experimentation was planned according to the face-centered central composite design. The obtained results were statistically analyzed, and response surface methodology (RSM) was used to model the wafering speed and surface roughness. From the analysis of experimental results, it was noticed that at the higher level of Ton and Ip, a maximum wafering speed of 2.574 mm/min was attained. In contrast, the minimum surface roughness of 1.57 μm was achieved at the lower level of Ton and Ip. The most significant process variables that influence the wafering speed and surface roughness are the Ton, Toff, and Ip. Micrographs of the wafer surface reveal the presence of micro craters, but there was no evidence of micro-cracks. The multi-objective optimization of the responses was done using the desirability approach, and the optimized values of wafering speed and surface roughness attained were 0.989 mm/min and 1.57 μm, respectively.
“…However, various advanced finishing techniques have been explored in pursuit of attaining damage-free, nano-level, or angstrom-level surface finishes on challenging materials. These include Abrasive Flow Finishing (AFF), Chemical Mechanical Polishing (CMP), Elastic Emission Machining (EEM), Magnetic Abrasive Finishing (MAF), Magnetorheological Finishing (MRF), and Plasma-Assisted Polishing (PAP) [135]. Electrolytic polishing is exclusively viable for metals.…”
Injection moulds are crucial to produce plastic and lightweight metal components. One primary associated challenge is that these may suffer from different types of failures, such as wear and/or cracking, due to the extreme temperatures (T), thermal cycles, and pressures involved in the production process. According to the intended geometry and respective needs, mould manufacturing can be performed with conventional or non-conventional processes. This work focuses on three foremost alloys: AMPCO® (CuBe alloy), INVAR-36® (Fe-Ni alloys, Fe-Ni36), and heat-treated (HT) steels. An insight into the manufacturing processes’ limitations of these kinds of materials will be made, and solutions for more effective machining will be presented by reviewing other published works from the last decade. The main objective is to provide a concise and comprehensive review of the most recent investigations of these alloys’ manufacturing processes and present the machinability challenges from other authors, discovering the prospects for future work and contributing to the endeavours of the injection mould industry. This review highlighted the imperative for more extensive research and development in targeted domains.
“…One of the major applications of AWJM is cutting, which is used for a wide range of materials. AWJM can be used to cut metals like magnesium, 1 titanium, 2 stainless steel, 3 etc., for ship building, aerospace, automobile, construction industries, etc.. 4–5 It can also be used to cut a variety of ceramics such as glass, 6 concrete, granite, tiles, 7 etc. Furthermore, it can cut various advanced materials like composites, 8–9 and magnetic materials.…”
Section: Introductionmentioning
confidence: 99%
“…Furthermore, it can cut various advanced materials like composites, 8–9 and magnetic materials. Apart from cutting, AWJM is widely used in machining of difficult-to-machine materials, 10 paint/coating removal, cutting, 4 rock drilling, turning, milling, 7 polishing, 11 burr removal, 5 etc. AWJM is a versatile process attracting many applications because of its significant features like absence of heat-affected zones, low thermal-distortions caused in work-piece, low cutting forces, and environment-friendly nature.…”
Abrasive Water Jet Machining (AWJM) is an advanced machining process that has a variety of applications, including machining of hard-to-machine materials, drilling, milling, coating removal, polishing, etc. They are attractive because of their versatility, absence of heat-affected zones, low thermal-distortions, low cutting-forces, and environment-friendly nature. However, use of plain-water in AWJM poses some problems due to lack of jet coherence, poor suspension characteristics, and unsatisfactory performances in submerged-cutting and cutting of hollow surfaces. Countering these problems appropriately can lead to better cutting performances in terms of material removal rate, depth of cut, kerf-width, and kerf-taper. It can be achieved with addition of some additives in abrasive water-jet. These additives are mostly polymers of high molecular mass, which increases viscosity, suspension capability, and stability of jet, while reducing drag. In addition to AWJM, the effect of polymeric-additives in other water-based jets like Abrasive-Slurry-Jet (ASJ), High-pressure ASJ, etc. are also discussed. Therefore, this study aims to identify and list of different additives that are used in AWJM and other water-jet-based machining-processes over a past few decades, and to provide a run-through on their performances. It can provide the significant information to researchers working in fields related to waterjets.
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