2015
DOI: 10.1016/j.infrared.2014.09.022
|View full text |Cite
|
Sign up to set email alerts
|

Advanced inductively coupled plasma etching processes for fabrication of resonator-quantum well infrared photodetector

Abstract: Jhabvala, C. A.; Waczynski, A.; and Olver, K., "Advanced inductively coupled plasma etching processes for fabrication of resonator-quantum well infrared photodetector" (2015). t r a c tResonator-quantum well infrared photodetectors (R-QWIPs) are the next generation of QWIP detectors that use resonances to increase the quantum efficiency (QE). To achieve the expected performance, the detector geometry must be produced in precise specification. In particular, the height of the diffractive elements (DE) and the… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1

Citation Types

0
3
0

Year Published

2015
2015
2023
2023

Publication Types

Select...
7

Relationship

0
7

Authors

Journals

citations
Cited by 9 publications
(3 citation statements)
references
References 13 publications
0
3
0
Order By: Relevance
“…[18][19][20] For this work, we used an ASML stepper instead of a contact mask aligner to pattern all layers because of our submicron detector feature sizes and overlay tolerance. For the ASML PAS 5500 stepper, the wafer alignment marks are diffraction gratings as shown in Fig.…”
Section: Detector Fabricationmentioning
confidence: 99%
“…[18][19][20] For this work, we used an ASML stepper instead of a contact mask aligner to pattern all layers because of our submicron detector feature sizes and overlay tolerance. For the ASML PAS 5500 stepper, the wafer alignment marks are diffraction gratings as shown in Fig.…”
Section: Detector Fabricationmentioning
confidence: 99%
“…Etching is one of the key processes in the fabrication of semiconductor optoelectronic devices. Among them, Inductively Coupled Plasma (ICP) etching technology is a high-density plasma etching process that combines physical and chemical effects, with advantages such as high plasma density, high control accuracy, and good uniformity [1][2][3] . The etching effect of ICP is affected by process parameters such as gas composition and ratio, chamber pressure, ICP power, and RF power [4][5] .…”
Section: Introductionmentioning
confidence: 99%
“…[9][10][11][12] The selective etching process could yield a very high selectivity of etching GaAs over Al 0.4 Ga 0.6 As (>5000∶1) and a fast GaAs etching rate (2700 Å∕ min). The etching surface was perfectly smooth and mirror-like after processing.…”
mentioning
confidence: 99%