Advanced micromachining combining nanosecond lasers with water jet-guided laser technology

Pauchard, A.; Lee, K.; Vago, Nandor; Pavius, Michaël; Obi, S.

doi:10.1117/12.814712

Cited by 5 publications

(3 citation statements)

References 3 publications

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“…216 The induced HAZ is fairly wide for a dry laser by simple calculation, but for water jet guided laser process, no detailed characterization of HAZ has been found. However, it does not change the laser ablation mechanism.…”

Section: Water Jet Guided Laser Dicing Technologymentioning

confidence: 99%

“…210,211 The low-pressure water jet emitted from the nozzle guides the laser beam by means of total reflection at the transition zone between water and air, in a manner similar to conventional optical fibers. The mechanical force of the water jet onto the wafer is claimed to be less than 0.1 N. 208,215,216 As for the laser sources, either flash-lamp pumped pulsed Nd:YAG lasers or Q-switched lasers at 1064, 532, or 355 nm can be employed. 212 Pure DI and filtered water, pressurized at 50-600 bars depending on the nozzle diameter, is used for the water jet.…”

Section: Water Jet Guided Laser Dicing Technologymentioning

confidence: 99%

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Die singulation technologies for advanced packaging: A critical review

Lei

Kumar

Yalamanchili

2012

Journal of Vacuum Science &Amp; Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phen

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Die singulation, also known as wafer dicing, is reviewed in terms of the brief history, critical challenges, characterization of singulation quality, different singulation technologies and underlying mechanisms, and post-singulation die strength enhancement. Mechanical blade dicing has been the workhorse of die separation in the semiconductor manufacturing process. It faces growing challenges due to the adoption of copper/low-k dielectric interconnect structures, thin and ultra-thin wafers, die attach films, narrow dicing streets, and complex stacked structures on the dicing streets. Key dicing quality characteristics are chipping, delamination, kerf geometry, die side wall damage, die surface contamination, and die strength degradation. Various die singulation technologies have been developed to address these challenges and quality issues, including dicing by thinning, laser based approaches, laser and mechanical hybrid method, and plasma dicing. Die strength is a critical parameter for thin and ultra-thin dies. Post-dicing die strength enhancement is becoming the complement of most dicing technologies to achieve dies with high fracture strength. Plasma dicing has the potential to achieve much higher die strengths than all the other dicing approaches.

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Section: Water Jet Guided Laser Dicing Technologymentioning

confidence: 99%

Section: Water Jet Guided Laser Dicing Technologymentioning

confidence: 99%

Die singulation technologies for advanced packaging: A critical review

Lei

Kumar

Yalamanchili

2012

Journal of Vacuum Science &Amp; Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phen

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show abstract

“…Some studies report an increase in the machining rate, while some report decreased machining rates due to the application of water [242]. Water jetguided laser micromachining is reported in the literature [244,245], where water jet can help guide the laser beam, increase the working distance, reduce contamination, and produce a cooling effect.…”

Section: Hybrid or Modified Laser Micromachining Processesmentioning

confidence: 99%

Overview of Laser Applications in Manufacturing and Materials Processing in Recent Years

Shin

Lei

et al. 2020

Journal of Manufacturing Science and Engineering

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Recent years have witnessed a rapid growth of the laser market. Figure 1 shows the recent revenues of laser sales with about 50% increase in revenue over recent four years , which far exceeds the growth of other industrial sectors. More than one third of this revenue belongs to the category of laser materials processing arena. Undoubtedly, lasers have been playing increasingly important roles in various industrial manufacturing sectors. This article is to capture some of important developments in the rapidly growing areas of laser-based manufacturing and materials processing and also describe important technological issues pertaining to various laser-based manufacturing processes. The topics to be covered in this paper include more popularly used processes in industry such as laser additive manufacturing, laser-assisted machining, laser micromachining, laser forming, laser surface texturing, laser welding, and laser shock peening, although there are several additional areas of laser applications. In each section, a brief overview of the process is provided, followed by critical issues in implementing the process, such as properties, predictive modeling, and process monitoring, and finally some remarks on future issues that can guide researchers and practitioners.

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Fabrication of semicircular micro-grooves on Ti6Al4V by through-mask scanning electrochemical machining

Miao

Chen

et al. 2023

Int J Adv Manuf Technol

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Advanced micromachining combining nanosecond lasers with water jet-guided laser technology

Cited by 5 publications

References 3 publications

Die singulation technologies for advanced packaging: A critical review

Die singulation technologies for advanced packaging: A critical review

Overview of Laser Applications in Manufacturing and Materials Processing in Recent Years

Fabrication of semicircular micro-grooves on Ti6Al4V by through-mask scanning electrochemical machining

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