Advanced reliability study on high temperature automotive electronics

Abstract

To ensure high reliability for advanced automotive electronics, investigation and understanding on the failure mechanisms under harsh conditions are needed. New methods and technologies for improved reliability and increased lifetime should be developed. In this paper, an investigation on the effect of high temperature aging on the thermomechanical properties, microstructure of the molding compounds and the reliability issues of the packages is presented. Experimental characterizations of aging effect on the packaging materials and the package were carried out. DMA, TMA and TGA were used to measure the moduli, coefficients of thermal expansion (CTE), and the shrinkage induced by the aging process. Construction analysis was performed to examine the aging effect on the microstructure of the aged samples. It is found that aging has significant influence on the rubbery modulus, the glass transition temperature (Tg) and the strength. Aging-induced shrinkage was also found. Oxidation is believed to be one of the main mechanisms for the degradation of the material properties.

Thermal Management Technologies Used for High Heat Flux Automobiles and Aircraft: A Review

“…Moreover, the future development trends of automotive electric devices favor higher speeds and smaller sizes accompanied by better performance, which will accordingly raise the heat generation rates of ECU and TCU, thus leading to more strict requirements of thermal management techniques [12]. In addition to the high ambient temperature, many other environmental factors, such as vibration and abrupt acceleration, may also affect the reliability and performance of electric devices and related TMS [13]. When powertrain electronics are mounted directly onto ICEs and transmissions, some concerns about powertrain electronics might simultaneously occur due to vibrations, eventually leading to damage of the structural integrity and performance deterioration of the electronics.…”