Advanced Spreaders for Enhanced Cooling of High Power Chips

Abstract

Advanced spreaders for cooling a 10 x 10 mm underlying computer chip with a central hot spot (CHS) could remove > 85 W of dissipated thermal power at junctions' temperature < 100 o C. The spreaders comprise a 1.

Opaque Envelopes: Pathway to Building Energy Efficiency and Demand Flexibility: Key to a Low-Carbon, Sustainable Future

“…TAMs are engineered multilayer structures with alternating thermal properties in each layer; for buildings applications, TAMs generally have layers with alternating high and low thermal conductivities. TAMs have been used for thermal management in electronics applications [41,42,43] to redirect heat away from sensitive components. As shown in Figure 21, multilayer carbon-carbon TAMs were also used on the Space Shuttle Orbiter to manage thermal loads.…”