2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530)
DOI: 10.1109/asmc.2004.1309541
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Advanced STI patterning for 70 nm DRAM technology and beyond

Abstract: This paper presents the resufb on the patterning of shalfow french isolation for the 70nm DRAM technology node on 300mm wafers. Using a new friple hard mask approach incorporating a carbon plm patterns with 70nm CD and STI depth of abaut 250nm could be achieved. Keywords

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Cited by 2 publications
(3 citation statements)
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“…Recently, an MLR structure having an amorphous carbon (a-C) mask layer deposited by chemical vapor deposition (CVD) has been used. 1,2) CVD a-C has several potential applications, particularly in the microelectronics industry, because of its optical, electrical and mechanical properties. [3][4][5][6] Such a-C films can be obtained by several techniques, such as laser evaporation, ion beam and plasma deposition.…”
Section: Introductionmentioning
confidence: 99%
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“…Recently, an MLR structure having an amorphous carbon (a-C) mask layer deposited by chemical vapor deposition (CVD) has been used. 1,2) CVD a-C has several potential applications, particularly in the microelectronics industry, because of its optical, electrical and mechanical properties. [3][4][5][6] Such a-C films can be obtained by several techniques, such as laser evaporation, ion beam and plasma deposition.…”
Section: Introductionmentioning
confidence: 99%
“…Furthermore, only a few reports on the etch characteristics of a-C layers for MLR have been published. 1,2,6,12) In this work, a CVD a-C thin film layer, synthesized by RF plasma enhanced CVD (PECVD) method with methane (CH 4 ) and hydrogen (H 2 ) gases, was etched and its etch characteristics and the etch mechanism of the CVD a-C films were investigated using O 2 /N 2 /Ar inductively coupled plasmas (ICPs) at various gas flow ratios and plasma powers. Experimental results indicated that the etch rate and profile angle were decreased with increasing N 2 flow rate due to the increased formation of CN x phase on the a-C surface.…”
Section: Introductionmentioning
confidence: 99%
“…Due to the difficulties in directly etching the underlayer using an ArF PR mask, new schemes have been developed for nanoscale patterning, such as using multilayer resist ͑MLR͒ structures. [1][2][3] An MLR structure is typically composed of a SiO x or SiON hard mask, an amorphous carbon layer ͑ACL͒, and Si 3 N 4 or SiO 2 underlayers. The final Si 3 N 4 or SiO 2 underlayers are patterned with an etched ACL pattern.…”
mentioning
confidence: 99%