2018
DOI: 10.30919/es8d710
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Advanced Thermal Interface Materials for Thermal Management

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Cited by 18 publications
(19 citation statements)
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“…Thermal management has become more and more important, especially in the miniaturized modern equipment. [189][190][191] The exploration of high thermal conductivity (TC) and electrical insulation (EI) materials is very important. [192,193] The atomicgrade thin BN is a strong candidate for flexible electronic devices due to its wide band gap, high thermal conductivity, excellent strength, good flexibility and ideal thermal and chemical stability.…”
Section: Electrically Insulating (Ei) and Thermally Conductive (Tc) Mmentioning
confidence: 99%
See 1 more Smart Citation
“…Thermal management has become more and more important, especially in the miniaturized modern equipment. [189][190][191] The exploration of high thermal conductivity (TC) and electrical insulation (EI) materials is very important. [192,193] The atomicgrade thin BN is a strong candidate for flexible electronic devices due to its wide band gap, high thermal conductivity, excellent strength, good flexibility and ideal thermal and chemical stability.…”
Section: Electrically Insulating (Ei) and Thermally Conductive (Tc) Mmentioning
confidence: 99%
“…Thermal management has become more and more important, especially in the miniaturized modern equipment [189–191] . The exploration of high thermal conductivity (TC) and electrical insulation (EI) materials is very important [192,193] .…”
Section: The Applications Of Boron Nitride and Its Derived Nanomaterialsmentioning
confidence: 99%
“…The total thermal resistance of heat transfer is composed of two contact thermal resistance and thermal resistance of TIMs. Therefore, excellent thermal transport properties and [58][59][60] super wettability are the primary problems to be solved for TIMs. So far, many types of TIMs have emerged, like particle-filled polymers, liquid metal and carbon materials based TIMs.…”
Section: Graphene In Heat Transfer Enhancement For Thermal Interface mentioning
confidence: 99%
“…However, it is well-known that the issues of efficient heat dissipation and the thermal management of flexible electronic devices remain unresolved. 21,22 Thus, a fundamental understanding of thermal transport behavior in isolated Mo 6 S 6 NWs is highly desirable in order to advance their practical applications in making flexible nanodevices with, for example, improved performance and extended lifetime. To date, unlike CNTs, [23][24][25] the thermal transport characteristics of Mo 6 S 6 NWs are still unknown, let alone the thermal responses to deformation that inevitably occur when used as components of nanodevice systems.…”
Section: Introductionmentioning
confidence: 99%