Advancement solidification microstructure and mechanical properties of Sn–2.0Ag–0.5Cu alloy by applying a rotary magnetic field

Hammad, A.E.; Ragab, M.

doi:10.1007/s10854-019-02240-w

Cited by 7 publications

(2 citation statements)

References 40 publications

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“…These indicated that the incorporation of Sb can evidently improve the mechanical properties of SAC105 alloy. The microstructure characteristics of solder alloys inevitably control their mechanical properties (El-Taher et al , 2021; Hammad and Ragab, 2019). The heterogeneous nucleation points increased with the Sb doping, which resulted in the diminution of grain size and the generation of more grain boundaries to hinder dislocation movement (Sun et al , 2016; Bakshi and Agarwal, 2011; Sharma et al , 2015; Billah and Chen, 2015).…”

Section: Resultsmentioning

confidence: 99%

Effect of Ce and Sb doping on microstructure and thermal/mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder

Liu,

Wang,

Zhou

et al. 2024

SSMT

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Purpose The purpose of this study is to investigate the effects of Ce and Sb doping on the microstructure and thermal mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder. The effects of 0.5%Sb and 0.07%Ce doping on microstructure, thermal properties and mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder were investigated. Design/methodology/approach According to the mass ratio, the solder alloys were prepared from tin ingot, antimony ingot, silver ingot and copper ingot with purity of 99.99% at 400°C. X-ray diffractometer was adopted for phase analysis of the alloys. Optical microscopy, scanning electron microscopy and energy dispersive spectrometer were used to study the effect of the Sb and Ce doping on the microstructure of the solder. Then, the thermal characteristics of alloys were characterized by a differential scanning calorimeter (DSC). Finally, the ultimate tensile strength (UTS), elongation (EL.%) and yield strength (YS) of solder alloys were measured by tensile testing machine. Findings With the addition of Sb and Ce, the ß-Sn and intermetallic compounds of solders were refined and distributed more evenly. With the addition of Sb, the UTS, EL.% and YS of Sn-1.0Ag-0.5Cu increased by 15.3%, 46.8% and 16.5%, respectively. The EL.% of Sn-1.0Ag-0.5Cu increased by 56.5% due to Ce doping. When both Sb and Ce elements are added, the EL.% of Sn-1.0Ag-0.5Cu increased by 93.3%. Originality/value The addition of 0.5% Sb and 0.07% Ce can obtain better comprehensive performance, which provides a helpful reference for the development of Sn-Ag-Cu lead-free solder.

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Section: Resultsmentioning

confidence: 99%

Effect of Ce and Sb doping on microstructure and thermal/mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder

Liu,

Wang,

Zhou

et al. 2024

SSMT

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“…A new method is to use a rotating magnetic field (RMF) during the solidification of solder alloys (Ripley et al , 2015). The RMF influences the flow and coagulation of molten metals, which eliminates defects, reduces grain size and ultimately improves the overall performance of solder joints (El-Taher et al , 2021; Hammad and Ragab, 2019; Ibrahiem and El-Daly, 2019). Hammad (Hammad and Ragab, 2020) investigated the influence of the RMF on the fine texture and mechanical performance of SACZ (Sn-2.0Ag-0.5Cu-2.0Zn) and found that the grain size of β -Sn and intermetallic compounds (IMCs) decreased and the mechanical performance was enhanced under the RMF.…”

Section: Introductionmentioning

confidence: 99%

Effect of rotating magnetic field on the microstructure and properties of Sn-Ag-Sb lead-free solder alloys

Wang

Zhou

Liu

et al. 2022

SSMT

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Purpose The purpose of this paper is to study the microstructure and properties of Sn-3.5Ag and Sn-3.5Ag-0.5Sb lead-free solder alloys with and without a rotating magnetic field (RMF). Design/methodology/approach Optical microscopy, scanning electron microscopy and X-ray diffraction were used to analyze the effect of an RMF on the microstructure of the solders. Differential scanning calorimetry was used to study the influence of the RMF on the thermal characteristics of the solders. The mechanical properties of the alloys were determined by tensile measurements at different strain rates. Findings The ß-Sn grains and intermetallic compounds for the Sn-3.5Ag and Sn-3.5Ag-0.5Sb lead-free solder alloys were refined under an RMF, and the morphology of the ß-Sn grains changed from dendritic to equiaxed. The pasty range was significantly reduced under an RMF. The ultimate tensile strength (UTS) of Sn-3.5Ag improved under the RMF, whereas the UTS of Sn-3.5Ag-0.5Sb decreased slightly. The addition of Sb to the Sn-3.5Ag alloy significantly enhanced the UTS and elongation (El.%) of the samples. The UTS of the solder increased with increasing strain rate. Originality/value The results revealed that the application of RMF in the molten alloy had a significant effect on its microstructure and mechanical properties. The thermal characteristics of the Sn-3.5Ag and Sn-3.5Ag-0.5Sb solder alloys were improved under the RMF. This research is expected to fill a knowledge gap regarding the behaviour of Sn-Ag solder alloys under RMF.

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Influences of rotating magnetic field on microstructure and properties of Sn–Ag–Cu–Sb–Ce solder alloy

Wang

Liu

et al. 2023

J Mater Sci: Mater Electron

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Advancement solidification microstructure and mechanical properties of Sn–2.0Ag–0.5Cu alloy by applying a rotary magnetic field

Cited by 7 publications

References 40 publications

Effect of Ce and Sb doping on microstructure and thermal/mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder

Effect of Ce and Sb doping on microstructure and thermal/mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder

Effect of rotating magnetic field on the microstructure and properties of Sn-Ag-Sb lead-free solder alloys

Influences of rotating magnetic field on microstructure and properties of Sn–Ag–Cu–Sb–Ce solder alloy

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