2003
DOI: 10.1117/12.497952
|View full text |Cite
|
Sign up to set email alerts
|

Advances in laser soldering using high power diode lasers

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
6
0

Year Published

2006
2006
2012
2012

Publication Types

Select...
3
1

Relationship

0
4

Authors

Journals

citations
Cited by 4 publications
(6 citation statements)
references
References 0 publications
0
6
0
Order By: Relevance
“…From the applications point of view, beam quality and power of the laser define the potential application areas (Bachmann, 2003). In soldering applications, a very low power density is required (Beckett et al, 1997) and with moderate beam quality and high efficiency, diode lasers are well suited to soldering applications (Hoult et al, 2002;Bachmann, 2003). These lasers are capable of providing continuous wave (CW) power of several watts from single diodes and tens of watts CW from multiple emitter assemblies (Whitehead and Foster, 1995;Beckett et al, 1997).…”
Section: Selection Of Candidate Reflow Toolsmentioning
confidence: 99%
See 1 more Smart Citation
“…From the applications point of view, beam quality and power of the laser define the potential application areas (Bachmann, 2003). In soldering applications, a very low power density is required (Beckett et al, 1997) and with moderate beam quality and high efficiency, diode lasers are well suited to soldering applications (Hoult et al, 2002;Bachmann, 2003). These lasers are capable of providing continuous wave (CW) power of several watts from single diodes and tens of watts CW from multiple emitter assemblies (Whitehead and Foster, 1995;Beckett et al, 1997).…”
Section: Selection Of Candidate Reflow Toolsmentioning
confidence: 99%
“…The reported studies have mainly addressed standard and fine pitch SMCs down to pitches of 0.635 mm (25 mil), (Geren, 2003). Since the 1990s further research has considered automation of rework for fine pitch SMCs (Laferriere and Fukumoto, 1995;Beckett et al, 1997) and both for TH and surface mount technology components (Hoult et al, 2002). Furthermore, a recent study carried out by Geren (2003) into rework technology selection based on overall rework cost per component indicates that the use of fully automated rework cells are economically justifiable up to a capital cost of e200,0000.…”
Section: Introductionmentioning
confidence: 99%
“…Candidate reflow tools that possibly fulfill the requirements in the requirements list have to be found using solution finding methods. For this purpose the literature and catalogues of reflow system manufacturers were studied and the results are tabulated in Table III (Wang et al , 2001; Hoult et al , 2002; Li, 2000; Svelto, 2009; Beckett et al , 2002; McCluskey et al , 1997). Solutions obtained are as hot air/gas, infrared (IR), high power diode laser (HPDL), CO 2 laser, neodymium‐doped yttrium aluminum garnet (Nd:YAG) laser and diode‐pumped solid‐state neodymium‐doped yttrium aluminium garnet (DPSS Nd:YAG) laser.…”
Section: Designing a Pcba Rework Cell Using The New Generic Mechanical Design Methodologymentioning
confidence: 99%
“…As a result, research in this field has been concentrated on the automation of PCBA rework. There have been a number of reported attempts to automate rework for fine pitch (down to pitches of 0.635 mm (25 mil) surface mount components (SMCs) (Laferriere and Fukumoto, 1995; Beckett et al , 1997) and both for through‐hole (TH) and SMCs (Hoult et al , 2002) for plastic ball grid array (PBGA) components (Liu et al , 2002), and others for both standard, fine pitch and advanced SMCs including flip chips (FCs) (Hanreich et al , 2001; Russell, 2000; Wang et al , 2001). These are stand alone machines, designed for repeated assembly and rework operations on a limited component range with limited capabilities.…”
Section: Introductionmentioning
confidence: 99%
“…Laser soldering presents the most promising technique for highvolume production because of easy automation, a non-contact technique, localized heating, and rapid heating and cooling cycles, which minimize distortions and heating damage [3,4]. Some authors [5][6][7] have proposed lead-free laser soldering for overlap and flanged seam geometries, using as low as 10 W laser power.…”
Section: Introductionmentioning
confidence: 99%