Advances in material development for high power, vacuum interrupter contacts

Slade, Paul G.

doi:10.1109/95.296374

Cited by 143 publications

(53 citation statements)

References 29 publications

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“…The tendency of materials of this system to forming (retaining) a skeletal structure limits the possibility of regulating structural parameters that determine electric and thermal conductivity, strength, ductility and other material properties. Introduction of elements of the iron family into Cr − Cu composite materials leads to improvement of the operating characteristics of arcing contacts for vacuum switches [2]. There are no published works devoted to studying the structure and phase formation in dispersed (powder) Cr − Cu − Ni(Co, Fe) systems under LPS conditions, which gave rise to the requirement for the present study.…”

Section: Introductionmentioning

confidence: 98%

Structure formation during sintering in the presence of a liquid phase in Cr-Cu-metal of the iron family systems. II. Systems Cr-Cu-Ni(Co, Fe)

Get’man

Lesnik

Minakova

et al. 2006

Powder Metall Met Ceram

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621 .7 62 .66 9. 01 8:6 69′′35 Features of structure and phase formation in Cr − Cu − Ni(Co, Fe) systems during liquid-phase sintering in a vacuum of (2-4) ⋅ 10 −3 Pa at 1200 and 1270°C are studied. It is shown that with introduction of elements of the iron family into molten copper there is dispersion of refractory particles and formation at the boundary with the readily melting component of a transition layer whose structure and composition are determined by the nature of the addition. Growth of refractory particles during liquid-phase sintering of composites of the system Cr − Cu − Ni is controlled by diffusion of elements into the solid phase of the transition layer.

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Section: Introductionmentioning

confidence: 98%

Structure formation during sintering in the presence of a liquid phase in Cr-Cu-metal of the iron family systems. II. Systems Cr-Cu-Ni(Co, Fe)

Get’man

Lesnik

Minakova

et al. 2006

Powder Metall Met Ceram

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“…La 2 NiO 4 powders were synthesized through a sol-gel strategy that both Ni(NO 3 ) 2 and La(NO 3 ) 3 were used as precursors, as shown in detail in Ref. [8].…”

Section: Methodsmentioning

confidence: 99%

“…To strengthen Cu for electrical contact applications, alloying is an effective approach, e.g., Cr, W for Cu contacts in vacuum interrupters [2,3]. Anidow et al [4] alloyed Cu with 9 at.% La to reduce the contact resistance through doping cuprous oxide.…”

Section: Introductionmentioning

confidence: 99%

Preparation, electrical contact performance and arc-erosion behavior of Cu/La2NiO4 composites

Yongli

Zhou²,

Wang

2015

Proceedings of the 3rd International Conference on Material, Mechanical and Manufacturing Engineering

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Abstract. La 2 NiO 4 conductive particles were incorporated into Cu matrix for enhanced electrical contact performance, while their effect on the arc erosion behavior of contacts was investigated. The results indicate that the particles in the hot-pressed Cu/La 2 NiO 4 composites accelerate the separation of oxide scales from contact surface during arc erosion cycling, suggested by increased mass loss of roughly 3 to 9 times larger than pure Cu. Thus, the growth of oxide scales on contact surface was blocked by a self-cleaning-like function. As a result, the contact resistance declines to 21.6 mΩ after 5000 cycles, in contrast with 29.5 mΩ for Cu, and correspondingly the temperature rise degrades about 30.7%.

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“…[1] With the decreasing of the grain size, the properties of the CuCr materials can be improved significantly. Rieder et al reported that the maximum chopping current decreased and the breakdown field increased significantly when the size of Cr particles in CuCr contact materials were reduced from about 150 to 36 lm.…”

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confidence: 99%

Properties of Nanocrystalline CuCr50 Contact Material

et al. 2005

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CuCr alloys are the predominant contact materials for medium-voltage, high-current vacuum interrupters (VIs) due to the unique combination of the properties of the two constituents. [1] With the decreasing of the grain size, the properties of the CuCr materials can be improved significantly. Rieder et al. reported that the maximum chopping current decreased and the breakdown field increased significantly when the size of Cr particles in CuCr contact materials were reduced from about 150 to 36 lm. [2] The microstructure of conventional CuCr materials prepared by powder metallurgy mainly depends on original Cu and Cr powders. CuCr materials, manufactured by arc melting with a grain size of 15±30 lm, have better performance than that of conventional CuCr materials with a grain size 74±150 lm. [3] Because of the limitation of cooling rate, the grain size of the CuCr contact materials manufactured by arc melting technique cannot be fine further. Mechanical milling/alloying, which was first developed by Benjamin for the production of complex oxide dispersion strengthened alloys, is found to be particularly suitable for yielding relatively large quantities of the powders with nanocrystalline grains. [4] In this paper, nanocrystalline CuCr50(nc-CuCr50) contact material were prepared by mechanical alloying and hot press sintering techniques(HPS). The properties and microstructure as well as surface morphology of nc-CuCr50 prepared by HPS after arcing were investigated.Results: Figure 1 shows the XRD patterns of the original and milled Cu, Cr powders and the nc-CuCr50 sample. The diffraction peaks of Cu and Cr powders were broadened and lowered significantly after high energy milling, indicating a decreasing of the grain size. For the nc-CuCr50 specimen, the intensity of diffraction peaks is similar to that of milled powder, the broadened and lowered peaks show that the grain size is small. Based on TEM results, as shown in Figure 2, the grain size was less than 50 nm, which is in good agreement with the results of XRD. COMMUNICATIONS

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Advances in material development for high power, vacuum interrupter contacts

Cited by 143 publications

References 29 publications

Structure formation during sintering in the presence of a liquid phase in Cr-Cu-metal of the iron family systems. II. Systems Cr-Cu-Ni(Co, Fe)

Structure formation during sintering in the presence of a liquid phase in Cr-Cu-metal of the iron family systems. II. Systems Cr-Cu-Ni(Co, Fe)

Preparation, electrical contact performance and arc-erosion behavior of Cu/La2NiO4 composites

Properties of Nanocrystalline CuCr50 Contact Material

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