often have to be connected using (external) fluidic interconnects. This way, the fluidic interconnects will have a relatively large volume, resulting in slow response times and requiring large sample sizes.To make the ideal integrated microfluidic handling system, one fabrication process should allow many different microfluidic devices for all kinds of applications to be integrated on the same chip. The functional channels of the devices, the interconnect channels and the required interfacing electronics should be integrated on the same substrate without restricting the design options for each device.Different applications pose different demands on the fabricated system. To avoid leakage and wear, the channel walls should be mechanically strong, chemically inert and leak tight for both liquids and gasses in a large temperature range. It should be possible to locally release the channel (completely or partially) from the substrate, e.g. for thermal isolation or freedom of movement. It is required to integrate transducer structures for actuation and measurement of the devices. This can be anything from metal tracks to piezoelectric or magnetic materials or optical waveguides. Functionalization of the inside of the channel, e.g. with a catalyst or with specific coatings for (bio)chemical reactions or adhesion should be possible. Multiple channels should be able to cross each other or run inside each other. Interface electronics should be integrated directly on the chip or package to reduce noise and other parasitic effects.To be able to transfer proof-of-concepts to commercial devices, it should not only be possible to fabricate low-volume research devices, but it should also be possible to scale up the fabrication to industrial low-cost, high-volume processing in foundries. Last, and certainly not least, it should be straightforward to design the optimal fluidic element with respect to shape and size, for any application.
AbstractMany microfluidic devices are made using specialized fabrication processes, limiting the ability to integrate those devices on the same chip. In this paper, a versatile technology platform is presented that allows for integration of many different devices. It provides a method to design channels in a wide range of sizes and shapes with different functionalization options in close proximity to the fluid in the channels. The latter includes release of the channels for thermal isolation or mechanical movement and metal or piezoelectric layers for actuation and read-out. The channel walls are made using silicon-rich silicon nitride to provide durable, strong, chemically inert and thermally stable channels directly below the substrate surface .