Aerosol Jet Printed Microstrip Lines on Polyimide for D-Band

Gramlich, Georg; Hebeler, Joachim; Bøhn, Christian; Lemmer, Uli; Zwick, Thomas

doi:10.23919/eumc50147.2022.9784303

Cited by 3 publications

(2 citation statements)

References 9 publications

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“…Therefore, it is not a surprise to see little differences between the microstrip lines of the same aspect ratio but with different resistance values. However, with an ink of much higher resistivity the printed line resistance can play a considerable role in microstrip losses for D-band RF applications [18]. However, geometric factors such as aspect ratio can be expected to alter the fringe fields and consequently and transmission line impedance.…”

Section: Table 1: Process Conditions For Obtaining Various Resistance...mentioning

confidence: 99%

Aerosol Jet Printed Interconnects for Millimeter-Wave Components

Feng,

Germann,

Ramm

et al. 2023

Journal of SMT

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As millimeter wave RF device applications expand above traditional microwave frequency bands in the global communications, automotive and Mil-Aero markets, the need to limit interconnect signal losses related to parasitic elements has never been more important. As the frequency increases, device designers are facing numerous challenges, complications, and costs when fabricating interconnects with techniques such as copper pillar bumps, wire, ribbon or wedge bonding in 3DIC packaging. Printing conformal interconnects with Aerosol Jet® direct-write technology can offer package designers and RF engineers a new approach for optimizing interconnect transitions to active die, tailoring the loss characteristics to specific application requirements and eliminating the need to compensate for high signal transmission losses. Printed interconnects can be digitally designed into the package with a variety of metallic and dielectric materials. As these interconnects are conformally printed on the 3D surface of the package, the trace length can be minimized with zero loop height, reducing parasitic inductance to active die circuitry specifically for die on board, die in trench, or die on die with pads-up packaging configurations. In this work, Aerosol Jet® printed interconnects with silver nanoparticle inks are compared with the gold microstrip transmission lines as well as traditional gold bond wires, for performance up to 110 GHz. We will share examples showcasing that the printed interconnects can have similar RF transmission performance to microstrip, with significantly lower loss than bondwires especially at high frequencies. We will also discuss design effects for Aerosol Jet® printed RF interconnects up to 110 GHz based on a set of results for different line heights with a given line width printed with a silver ink.

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Section: Table 1: Process Conditions For Obtaining Various Resistance...mentioning

confidence: 99%

Aerosol Jet Printed Interconnects for Millimeter-Wave Components

Feng,

Germann,

Ramm

et al. 2023

Journal of SMT

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“…The higher the operating frequency is, the more pressing these requirements become. In our own work on printed AJ millimeter-wave circuitry [10] and packages [11], we have collected experience on AJ printing process optimization for structures with minimum feature sizes down to 20 µm. They require a dimensional accuracy of at least 5 µm.…”

Section: Introductionmentioning

confidence: 99%

Process considerations for Aerosol-Jet printing of ultra fine features

Gramlich

Huber

Häslich

et al. 2023

Flex. Print. Electron.

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In recent years, Aerosol-Jet (AJ) printing has become an increasingly popular technology applied in research ranging from the biomedical field to military applications to printed semiconductors. Extensive efforts have been made to understand the influence of process parameters and the underlying physical principles. Nevertheless, little attention has been paid to the optimization of ultra-small and highly precise printed features. Pushing the printer to its limits and manufacturing structures as small as tens of microns with a micrometer accuracy poses significant challenges, because effects that can be ignored for printing large features play a crucial role. This study demonstrates how the printing speed quickly causes intolerable distortions. In contrast to large-feature printing, the printing speed cannot be used as a free parameter to set the print thickness. We will discuss the non-constant printing behavior induced by the divert/boost shutter and present shutter on the fly as a solution to many problems, but only if the subroutine code is optimized. The modifications made to the code are disclosed in this paper for the first time. Knowing that printing precise features often results in a high print thickness, we will briefly discuss the issue of cracks caused by the drying of thick nanoparticle films. Altogether, this paper presents a range of important considerations for AJ printing ultra-fine features and an interesting insight into the particularities of operating the printer at its limits.

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