2008
DOI: 10.1016/j.apsusc.2007.12.038
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AES, EELS and TRIM investigation of InSb and InP compounds subjected to Ar+ ions bombardment

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Cited by 11 publications
(5 citation statements)
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“…The structure of these EELS spectra, as shown in Fig. 1 changed in comparison with the one of cleaned InP [11]. The effect of Ar + ions on InP led to appearance of peaks located at 8.6 eV and 11.6 eV, interpreted as due to surface and bulk plasmons of In metal; this is in agreement with the EELS spectrum (e) of pure In metal taken for comparison [12][13][14][15][16][17][18].…”
Section: Aes and Eels Of Inpsupporting
confidence: 74%
See 1 more Smart Citation
“…The structure of these EELS spectra, as shown in Fig. 1 changed in comparison with the one of cleaned InP [11]. The effect of Ar + ions on InP led to appearance of peaks located at 8.6 eV and 11.6 eV, interpreted as due to surface and bulk plasmons of In metal; this is in agreement with the EELS spectrum (e) of pure In metal taken for comparison [12][13][14][15][16][17][18].…”
Section: Aes and Eels Of Inpsupporting
confidence: 74%
“…After an ionic bombardment during a 10 min and a moderate heating in UHV at 250 8C, the Auger signals C-KLL and O-KLL vanished completely. Furthermore, the recorded EELS spectra revealed the main energy loss peak located at 15.4 eV, due to bulk plasmons of clean InP as described in our results [11].…”
Section: Aes and Eels Of Inpmentioning
confidence: 61%
“…The theoretical calculation based on the approximations gradient generalized approximation (GGA) and modified Beck Johnson (mBJ) have proved their performance to predict the physical properties of materials . In this study, we associate the experimental results related to characterization methods auger electron spectroscopy (AES), electron energy loss spectroscopy (EELS), UV photoelectron spectroscopy (UPS), and photoluminescence (PL) to theoretical results obtained by GGA and mBJ. …”
Section: Introductionmentioning
confidence: 99%
“…The most of these applications, metal-InP Schottky structures of good quality is required [1][2][3][4]. The nature and quality of surface preparation in semiconductor technology is of the utmost importance during device fabrication and has a pronounced influence on the performance of these devices [5][6][7][8].…”
Section: Introductionmentioning
confidence: 99%