2017
DOI: 10.1149/2.0091709jss
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AFM and SEM Study on Crystallographic and Topographical Evolutions of Wet-Etched Patterned Sapphire Substrate (PSS): Part II. Cone-Shaped PSS Etched in H2SO4and H3PO4Mixture with Varying Volume Ratio at 230°C

Abstract: Here we present a systematic study on crystallographic and topographical evolutions as well as etching rates of crystallographic planes of cone-shaped patterned sapphire substrate (PSS) etched in H 2 SO 4 and H 3 PO 4 mixture with a wide range of volume ratios (H 2 SO 4 :H 3 PO 4 = 1:0, 5:1, 3:1, 1:1, 1:3, and 0:1) at 230 • C. The Miller indexes of four major exposed crystallographic planes were determined as S 1 {11 0 5}, S 3 {45 1 38}, S 4 {11 0 12}, and S 6 {11 0 8}. The etching rates of crystallographic pl… Show more

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Cited by 13 publications
(42 citation statements)
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“…At 250 min, S 4 -zones were completely etched away, and then quasi-hexagrams changed to separated triangular pyramids exposed with only S 5 -zones. Compared with the etching at higher temperature of 503 K reported in Part II, 21 some noticeable differences can be found. First, the crystallographic and topographical evolutions of patterns are much slower at 473 K. For instance, triangular pyramids exposed with only S 5 -zones (Fig.…”
Section: Resultsmentioning
confidence: 59%
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“…At 250 min, S 4 -zones were completely etched away, and then quasi-hexagrams changed to separated triangular pyramids exposed with only S 5 -zones. Compared with the etching at higher temperature of 503 K reported in Part II, 21 some noticeable differences can be found. First, the crystallographic and topographical evolutions of patterns are much slower at 473 K. For instance, triangular pyramids exposed with only S 5 -zones (Fig.…”
Section: Resultsmentioning
confidence: 59%
“…23 Careful comparisons about etching behaviors of PSS in H 2 SO 4 at various temperatures are essential for revealing the temperature dependence of the crystallographic and topographical evolutions as well as the etching mechanism. As reported in Part II of this series, when the etchants of pure H 2 SO 4 or with rather low H 3 PO 4 concentration (i.e., H 2 SO 4 :H 3 PO 4 = 1:0 and 10:1 at volume ratio) are used, many alunogen crystals (Al 2 (SO 4 ) 3 · 17H 2 O) and irregular protrusions are created on CPSS, 21 thus hindering observation of the crystallographic and topographical evolutions as well as determination of etching rates of crystallographic planes. Therefore, H 2 SO 4 -based etchant with a moderate H 3 PO 4 concentration, i.e., M5-1 (H 2 SO 4 :H 3 PO 4 = 5:1 at volume ratio), was chosen to avoid the interference of alunogens.…”
Section: Resultsmentioning
confidence: 81%
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