The effect of etching temperature (473-543 K) on the crystallographic and topographical evolutions as well as the etching rate of crystallographic planes of cone-shaped patterned sapphire substrate (PSS) etched in both H 2 SO 4 -based (H 2 SO 4 :H 3 PO 4 = 5:1 at volume ratio) and H 3 PO 4 etchants was systematically studied. For H 2 SO 4 -based etchant, higher temperature favors larger etching rate ratio of slant planes (S 1 {11 0 5}, S 3 {45 1 38}, S 4 {11 0 12}, and S 5 {1 1 0 37} planes) to c-plane, thus leading to smaller filling factor (FF) of patterns; the Arrhenius activation energy (E a ) of etching reactions for various crystallographic planes follows the order: E a (c) < E a (S 1 ) < E a (S 3 ) < E a (S 4 ). For H 3 PO 4 , higher temperature favors smaller etching rate ratio of slant planes (S 1 {11 0 5} and S 6 {11 0 8} planes) to c-plane and larger FF of patterns; the E a follows the order: E a (S 1 ) < E a (S 6 ) < E a (c). This work will contribute to elucidating the etching mechanism and fabricating optimized PSS for enhanced performance of light emitting diodes.