Ag–Cu Bimetallic Nanoparticles with Enhanced Resistance to Oxidation: A Combined Experimental and Theoretical Study

Abstract

A simple oleylamine-based thermal decomposition process using different time steps for precursor injection was used to obtain bimetallic Ag−Cu nanoparticles with a narrow size distribution. Experimental and theoretical studies were carried out to demonstrate that these bimetallic nanoparticles are less prone to oxidation. The calculated energy trends for O 2 adsorption on the nanoparticles show that the adsorption energy declines rapidly when more than six O 2 molecules are present, indicating that O 2 is rarely adsorbed on Ag−Cu nanoparticles. Electron transfer from Cu to Ag within these bimetallic nanoparticles allows far better resistance to oxidation than monometallic Cu nanoparticles.

Synergistic effect in bimetallic copper–silver (CuxAg) nanoparticles enhances silicon conversion in Rochow reaction

“…AgNO 3 (A.R., Sinopharm Chemical Reagent Co., Ltd, China) was used as the Ag precursor, Cu(CH 3 COO) 2 (A.R., Sinopharm Chemical Reagent Co., Ltd, China) as the Cu precursor, and oleylamine (C 18 H 37 N, Sigma-Aldrich) as the solvent, surfactant and reducing agent. 42,43 All chemicals were used as received without further purication. In a typical synthesis for CuAg nanoparticles, 10 mmol of Cu(CH 3 COO) 2 and 10 mmol of AgNO 3 were added to 80 mL of oleylamine in a three neck ask, which was then heated to 180 C for 8 h with stirring.…”

Silver–copper nanoalloys-an efficient sensitizer for metal-cluster-sensitized solar cells delivering stable current and high open circuit voltage

“…When bimetallic or alloyed CLs are used as sensitizers, the mechanism for the movement of electrons becomes a little complex. For AgeCu alloyed CLs, the movement of electrons takes place from Cu to Ag CLs [43]. It suggests that, in AgeCu alloyed sensitizers, the electron injection takes place from Cu into Ag followed by the injection of electrons from Ag into TiO 2 conduction band.…”

Synthesis with Glucose Reduction Method and Low Temperature Sintering of Ag-Cu Alloy Nanoparticle Pastes for Electronic Packaging

“…Another reason was recently proposed by Kim et al that electron transfer from Cu to Ag within these bimetallic nanoparticles allows far better resistance to oxidation than monometallic Cu nanoparticles. 18) 3.3 Electrochemical migration resistance of the Ag-Cu alloy nanoparticle paste Figure 6 shows the results of the water-drop test. The time for short circuit (current reaching 1 mA) of Ag counterelectrodes with distilled water under 5 V was less than 60 s, while the current of Ag-Cu alloy counterelectrodes kept decreasing and never reached the short circuit current during the experiment.…”