Ag metal interconnect wires formed by pseudoplastic nanoparticles fluid imprinting lithography with microwave assistant sintering

Abstract

Nanoimprint technology has the advantages of low cost, high precision, high fidelity and high yield. The metal nanoparticle fluid is non-Newtonian fluid，which is used as the imprint transfer medium to realize high fidelity of pattern because of its the shear thinning effect. In order to functionalize the metal nanoparticles microstructure, the subsequent sintering step is required to form a metal interconnect wire. Metal interconnect wire with fewer grain boundaries and fewer holes have excellent mechanical and electronic properties. In this paper, the pseudoplastic metal nanoparticle fluid was formed by Ag nanoparticle and precursor solution, and then the thermal diffusion process was completed by microwave sintering after interconnects were embossed. The influence of microwave and thermal atmosphere on the microstructure and performance of Ag Interconnect wires was analyzed and discussed, and the Ag Interconnect wires performance was determined under the influence of time and temperature parameters. In our experiments, the interconnects after microwave sintering can achieve 39% of the conductivity of bulk silver. The microwave sintering module might be integrated as the heat treatment module of the metal micro/nano pattern directly imprint lithography.

Mechanism of Imprinting Process in the Ni-P Metallic Glass Films: A Molecular Dynamics Study

“…Fabrication of engineering components at micro/nanoscale is one of the huge challenges in the high-tech industries [1][2][3]. To overcome this issue, nanoimprinting lithography (NIL) has been proposed as a novel technique in which the fabricated patterns and components are the potential candidates for application in optical devices, micro-integration systems, nanomold production, and biological devices [4,5]. In this method, a mechanical deformation process is conducted to transfer the pattern onto the metallic flms by an imprinting-release procedure [6][7][8].…”