Ag nanoparticle as a new activator for catalyzing electroless copper bath with 2,2′-bipyridyl

Lee, Chien‐Liang; Syu, Chia-Chieh

doi:10.1016/j.electacta.2011.07.110

Cited by 14 publications

(9 citation statements)

References 21 publications

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“…Activation is an indispensable process for electroless copper deposition, in which the copper ions are reduced by the reducing agent, and the activator (catalyst) acts as the medium transferring electrons from the reducing agent to the copper ions. , The excellent catalytic activity of Pd for the ECD reaction makes the Pd-based activation technology the most common application in the contemporary ECD industry. Nevertheless, it is the high material cost of Pd that makes the idea of exploring the cost-efficient alternatives attractive. , It is well-established that, in addition to Pd, the transition metals including Au, Ag, and Cu also exhibit different degrees of catalytic activity toward the ECD reaction .…”

Section: Introductionmentioning

confidence: 99%

Sn-Nanorod-Supported Ag Nanoparticles as Efficient Catalysts for Electroless Deposition of Cu Conductive Tracks

Xie

et al. 2018

ACS Appl. Nano Mater.

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The applications of tin are extremely wide-ranging, in fields as diverse as Li-ion batteries, catalysis, and electronic packaging. It is always significant but still remains a great challenge to develop facile and efficient routes to synthesize Sn nanostructures. Herein, we report a facile chemical method to synthesize a Sn nanorod crystal at room temperature, and Ag ions are subsequently introduced to form the Sn-nanorod-supported Ag nanoparticles hybrid structure (Sn/Ag nanorods). The Sn/Ag nanorods exhibit comparable activity to the commercial Pd black in catalyzing the electroless copper deposition (ECD) reaction that is indispensable to fabricate printed circuit boards (PCBs). Furthermore, a screen printable adhesive is prepared by mixing the as-synthesized Sn/Ag nanorod powders and epoxy resin to fabricate activator patterns on epoxy laminate (EPL) and flexible substrates including polyethylene terephthalate (PET) and polytetrafluoroethylene (PTFE) fiber film. The printed areas are finally metalized by the ECD process to obtain the copper coatings with designed patterns that are confirmed to exhibit excellent electrical conductivity and flexibility.

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Section: Introductionmentioning

confidence: 99%

Sn-Nanorod-Supported Ag Nanoparticles as Efficient Catalysts for Electroless Deposition of Cu Conductive Tracks

Xie

et al. 2018

ACS Appl. Nano Mater.

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“…First, tin(II) chloride is dissolved in the PVB solution, electrospun as PVB/SnCl 2 NWs. When the NWs are immersed in silver nitrate aqueous solution, Ag + is reduced by Sn 2+ and forms a Ag seed layer on the surface, which acts as the catalytic nucleation site for Ag or Cu electroless deposition . Second, the substrates are spin-coated with hydrophobic polymer film before the PVB nanofiber electrospinning, so it is more energetically unfavorable for metal precursors to be reduced onto the substrates.…”

mentioning

confidence: 99%

Electrolessly Deposited Electrospun Metal Nanowire Transparent Electrodes

Hsu¹,

Kong²,

Wang³

et al. 2014

J. Am. Chem. Soc.

198

187

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Metal nanowire (MNW) transparent electrodes have been widely developed for their promising sheet resistance (R(s))-transmittance (T) performance, excellent mechanical flexibility, and facile synthesis. How to lower the junction resistance without compromising optical transmittance has become the key issue in enhancing their performance. Here we combine electrospinning and electroless deposition to synthesize interconnected, ultralong MNW networks. For both silver and copper nanowire networks, the R(s) and T values reach around 10 Ω/sq and 90%, respectively. This process is scalable and takes place at ambient temperature and pressure, which opens new opportunities for flexible electronics and roll-to-roll large-scale manufacturing.

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“…Subsequently, Ag NPls were partially covered by copper with the help of electroless copper deposition (Scheme “electroless copper deposition”). For this, an aqueous copper bath consisting of formaldehyde (0.1 mol L –1 , 37%, BP, USP, Merck), copper sulfate pentahydrate (0.05 mol L –1 , ≥99%, VWR), ethylenediaminetetraacetic acid (0.1 mol L –1 , 99.4–100.6%, Sigma-Aldrich), and 2,2′-bipyridine (32 μmol L –1 , ACS, Merck) analogous to the work of Lee, Syu and Chen et al was used. , The pH value of the solution was adjusted between 11.5 and 13.5 by adding sodium hydroxide platelets (≥98%, Sigma-Aldrich) and the bath was purged with nitrogen for 15 min. Afterward, the silver foil with the silver structure on top was inserted into the copper bath.…”

Section: Methodsmentioning

confidence: 99%

“…In contact with the Ag NPls, the copper ions were reduced by formaldehyde in an alkaline solution. The Ag NPls acted as a catalyst for the reaction. , Therefore, the reduction of copper occurs only on the surface of the Ag NPls and not in solution. Thus, the separation of the solution after the reaction was simple since no elemental copper remained in the solution.…”

Section: Methodsmentioning

confidence: 99%

Bimetallic Copper–Silver Catalysts for the Electrochemical Reduction of CO₂ to Ethanol

Robens

Hecker

Kungl

et al. 2023

ACS Appl. Energy Mater.

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The electrochemical reduction of carbon dioxide to ethanol is a promising way to make CO2 electrolysis economically feasible. In this work, a bimetallic catalyst of silver and copper is synthesized, and the effect of its copper content on the formation of ethanol is analyzed. By decreasing the near-surface copper content from 99 to 45% (measured by XPS) at a current density of −20 mA cm–2, the Faradaic efficiency of ethanol could be enhanced from 5 to 23%. Moreover, we show that with excess of CO, due to a lower copper and a higher silver near-surface content, the formation of ethanol is favored over ethylene.

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Ag nanoparticle as a new activator for catalyzing electroless copper bath with 2,2′-bipyridyl

Cited by 14 publications

References 21 publications

Sn-Nanorod-Supported Ag Nanoparticles as Efficient Catalysts for Electroless Deposition of Cu Conductive Tracks

Sn-Nanorod-Supported Ag Nanoparticles as Efficient Catalysts for Electroless Deposition of Cu Conductive Tracks

Electrolessly Deposited Electrospun Metal Nanowire Transparent Electrodes

Bimetallic Copper–Silver Catalysts for the Electrochemical Reduction of CO₂ to Ethanol

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Ag nanoparticle as a new activator for catalyzing electroless copper bath with 2,2′-bipyridyl

Cited by 14 publications

References 21 publications

Sn-Nanorod-Supported Ag Nanoparticles as Efficient Catalysts for Electroless Deposition of Cu Conductive Tracks

Sn-Nanorod-Supported Ag Nanoparticles as Efficient Catalysts for Electroless Deposition of Cu Conductive Tracks

Electrolessly Deposited Electrospun Metal Nanowire Transparent Electrodes

Bimetallic Copper–Silver Catalysts for the Electrochemical Reduction of CO2 to Ethanol

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Bimetallic Copper–Silver Catalysts for the Electrochemical Reduction of CO₂ to Ethanol